Abstract: A skew correction device including a first guide member which supports the sheet transported by the transport roller from a lower side thereof in a vertical direction and guides the sheet to the gate member, and a second guide member which is provided on an upper position from the first guide member in a vertical direction and which guides the sheet to the gate member. Here, the first guide member includes at least one rotating member which faces a transport passage of the sheet interposed between the first guide member and the second guide member and is rotatably provided at least in the center of the second guide member in a width direction intersecting a transport direction of the sheet.

Abstract: A skew correction device including a first guide member which supports the sheet transported from a lower side thereof in a vertical direction by the transport roller and which guides the sheet to the gate member and a second guide member which is provided on an upper position from the first guide member in a vertical direction and which guides the sheet to the gate member. Here, the second guide member includes at least one rotating member which faces a transport passage of the sheet interposed between the first guide member and the second guide member and is rotatably provided at least in the center of the second guide member in a width direction intersecting a transport direction of the sheet.

Abstract: A skew correction device which performs positional correction of a sheet while a tip end of the sheet transported in accordance with rotation of a transport roller comes into contact with a gate member so as to deform the sheet to be bent, includes: an upper guide member which is disposed between the transport roller and the gate member in a transport direction of the sheet and includes a restraining section which restrains bending deformation of the sheet and a contact range with respect to the sheet when the sheet is restrained is changeable.

Abstract: A skew correction device including: a first guide member which supports the sheet transported by the transport roller from a lower side thereof in a vertical direction and guides the sheet to the gate member; and a second guide member which is provided on an upper position from the first guide member in a vertical direction and guides the sheet to the gate member. Here, the first guide member includes at least one rotating member which faces a transport passage of the sheet interposed between the first guide member and the second guide member and is rotatably provided at least in the center of the second guide member in a width direction intersecting a transport direction of the sheet.

Abstract: A skew correction device includes: a first guide member which supports the sheet transported from a lower side thereof in a vertical direction by the transport roller and guides the sheet to the gate member; and a second guide member which is provided on an upper position from the first guide member in a vertical direction and guides the sheet to the gate member. Here, the second guide member includes at least one rotating member which faces a transport passage of the sheet interposed between the first guide member and the second guide member and is rotatably provided at least in the center of the second guide member in a width direction intersecting a transport direction of the sheet.

Abstract: A skew correction device which performs positional correction of a sheet while a tip end of the sheet transported in accordance with rotation of a transport roller comes into contact with a gate member so as to deform the sheet to be bent, includes: a lower guide member including an inclination section which is disposed between the transport roller and the gate member in a transport direction of the sheet such that a side of the inclination section facing the gate member is disposed higher than the other side thereof facing the transport roller. Here, the inclination section is configured to move in at least one direction of the transport direction and a vertical direction.

Abstract: The invention provides a semiconductor device and a method of fabricating the same in which the side faces and chip edge of an IC chip obtained by dicing a semiconductor wafer are coated with an overcoat film. A method of fabricating a semiconductor device in accordance with the present invention includes: 1) preparing a semiconductor wafer on which semiconductor elements are formed, 2) dicing the semiconductor wafer along scribed lines at a depth of 20 ?m or more to form grooves 4-along the scribed lines, 3) forming an overcoat film on the necessary parts of the semiconductor wafer including the surfaces of the grooves, 4) optionally forming a thick electrode, and 5) dividing the semiconductor wafer into individual IC chips and chip size packages by dicing the semiconductor wafer along the grooves.

Abstract: To provide a semiconductor device and a method for fabricating the same in which the side faces and chip edge of an IC chip obtained by dicing a semiconductor wafer are coated with an overcoat film. A method for fabricating a semiconductor device in accordance with the present invention includes following steps: 1) preparing a semiconductor wafer 1 on which semiconductor elements are formed, 2) a half cutting step of dicing the semiconductor wafer 1 along scribed lined at a depth of 20 &mgr;m or more to form grooves 4 along the scribed lines, 3) a step of forming an overcoat film on the necessary parts of the semiconductor wafer including the surfaces of the grooves, 4) optionally, a step of forming a thick electrode, and 5) a full cutting step to divide the semiconductor wafer into individual IC chips and chip size packages by dicing the semiconductor wafer along the grooves.