Patents by Inventor YUTARO YAMASHITA

YUTARO YAMASHITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130034
    Abstract: A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 18, 2024
    Inventor: YUTARO YAMASHITA
  • Publication number: 20240076278
    Abstract: The present invention provides a compound having an mPGES-1 inhibitory activity and useful for the prophylaxis or treatment of pain, rheumatism, osteoarthritis, fever, Alzheimer's disease, multiple sclerosis, arteriosclerosis, glaucoma, ocular hypertension, ischemic retinal disease, systemic scleroderma and/or cancer including colorectal cancer. The present invention relates to a compound of formula [I-a], [I-b] or [I-c] or a pharmaceutically acceptable salt thereof: wherein each symbol is as defined in the specification.
    Type: Application
    Filed: February 24, 2023
    Publication date: March 7, 2024
    Applicant: Japan Tobacco Inc.
    Inventors: Ikuo Mitani, Yutaro Hirono, Masaki Yamashita
  • Patent number: 11882646
    Abstract: A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: January 23, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Yutaro Yamashita
  • Publication number: 20230412904
    Abstract: This in-vehicle camera includes an infrared light source capable of projecting infrared light, a camera unit including a lens unit and an imaging device unit and having a sensitivity to a wavelength of the infrared light, and a board on which the infrared light source and the camera unit are mounted.
    Type: Application
    Filed: September 30, 2021
    Publication date: December 21, 2023
    Inventors: YUTARO YAMASHITA, SATOSHI NAKAYAMA
  • Patent number: 11830104
    Abstract: An image processing apparatus includes a first signal processing unit for generating a first image of a first angle of view from an image captured by a camera attached to a vehicle body, and an image superimposing unit for superimposing an image representing a part of the vehicle body on the first image.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 28, 2023
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yutaro Yamashita, Hirofumi Owaki, Takuya Yamaguchi
  • Publication number: 20230339496
    Abstract: A control device includes a recognition section that recognizes an environment around a mobile body, a diagnosis section that diagnoses, based on a recognition result of the recognition section, an intensity of an electromagnetic wave emitted to the mobile body while traveling, and a route planning section that determines a moving route of the mobile body based on a diagnosis result of the diagnosis section.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 26, 2023
    Inventor: YUTARO YAMASHITA
  • Publication number: 20230054092
    Abstract: A sensor module includes a housing, a board unit, an external connector, and a joining member. The housing includes a first case, and a second case that is welded to the first case. The board unit includes a sensor element, and is arranged in the housing. The external connector is provided to the second case, and includes an elastically deformable terminal that is electrically connected to the board unit. The joining member is mounted on the board unit and welded to the housing.
    Type: Application
    Filed: February 5, 2021
    Publication date: February 23, 2023
    Inventor: YUTARO YAMASHITA
  • Publication number: 20220353984
    Abstract: A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.
    Type: Application
    Filed: July 2, 2020
    Publication date: November 3, 2022
    Inventor: YUTARO YAMASHITA
  • Publication number: 20220274526
    Abstract: The imaging unit 500 captures an image using a lens having an effective image circle smaller than the imaging surface of an image sensor. A vignetting amount calculation unit 2212 of a detection unit 221 individually calculates, for four corners, a region size of a vignetting region generated in the captured image acquired by the imaging unit 500, for example. A determination unit 2214 detects a change in the region size calculated at the time of focus abnormality detection processing with respect to the region size calculated at the reference time, and determines that a focus abnormality is detected when the change in the region size exceeds a threshold at any of the four corners. This enables accurate detection of focus abnormality.
    Type: Application
    Filed: July 8, 2020
    Publication date: September 1, 2022
    Applicant: Sony Semiconductor Solutions Corporation
    Inventor: Yutaro Yamashita
  • Publication number: 20220084257
    Abstract: An image processing apparatus includes a first signal processing unit for generating a first image of a first angle of view from an image captured by a camera attached to a vehicle body, and an image superimposing unit for superimposing an image representing a part of the vehicle body on the first image.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 17, 2022
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Yutaro Yamashita, Hirofumi Owaki, Takuya Yamaguchi
  • Patent number: 10882464
    Abstract: Provided are an excellent vehicle-mounted camera to be used by being attached to a windshield or the like of a vehicle, a vehicle-mounted camera apparatus, and a method of supporting a vehicle-mounted camera. The vehicle-mounted camera includes a substrate, an image pickup element mounted on the substrate, an image processing circuit that is mounted on the substrate and processes a captured image by the image pickup element, a light collection optical unit that collects incident light, and a reflection unit that reflects output light from the light collection optical unit to the image pickup element. The vehicle-mounted camera further includes a casing that accommodates the substrate on which at least the image pickup element and the image processing circuit are mounted, the light collection optical unit, and the reflection unit.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: January 5, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Yutaro Yamashita
  • Publication number: 20190161024
    Abstract: Provided are an excellent vehicle-mounted camera to be used by being attached to a windshield or the like of a vehicle, a vehicle-mounted camera apparatus, and a method of supporting a vehicle-mounted camera. The vehicle-mounted camera includes a substrate, an image pickup element mounted on the substrate, an image processing circuit that is mounted on the substrate and processes a captured image by the image pickup element, a light collection optical unit that collects incident light, and a reflection unit that reflects output light from the light collection optical unit to the image pickup element. The vehicle-mounted camera further includes a casing that accommodates the substrate on which at least the image pickup element and the image processing circuit are mounted, the light collection optical unit, and the reflection unit.
    Type: Application
    Filed: May 30, 2017
    Publication date: May 30, 2019
    Inventor: YUTARO YAMASHITA