Abstract: A back plate includes a substrate, and an insulation layer and a pad group that are located on the substrate. The pad group includes at least two pads. The insulation layer includes openings. The pads protrude towards a side away from the substrate relative to the insulation layer. A mask includes through holes and a blind hole. The orthographic projections of the through holes on the substrate overlap orthographic projections of the pads on the substrate. The blind hole surrounds the through holes. A size of the blind hole in a thickness direction of the mask is greater than or equal to a size of the pad protruding from the insulation layer. An orthographic projection of the blind hole on the substrate and the orthographic projections of the through holes on the substrate after spliced cover the orthographic projections of the pads on the substrate.

Abstract: Provided are a display baseplate, a mould assembly, a spliced display module, and a display apparatus. The display baseplate includes a backplate light emitters and an encapsulation layer. The backplate includes a first main surface and a second main surface that are opposite to each other, and side surfaces connected to the first main surface and the second main surface light emitters are located on the first main surface, the encapsulation layer is at least partially located on the first main surface and covers the plurality of light emitters. The spliced display module includes a splicing units, the splicing units each include a splicing frame and a display baseplate, the display baseplate is fixed on the splicing frame with the light emitters away from the splicing frame; and the splicing frames of adjacent splicing units are spliced together. The display apparatus includes a display baseplate or a spliced display module.

Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.

Abstract: A light-emitting substrate includes a substrate, a reflective layer, at least one first alignment mark disposed on the substrate, a plurality of support columns and a plurality of light-emitting devices. The reflective layer is disposed on the substrate, and the reflective layer has a plurality of openings and a plurality of installation openings. The plurality of openings include at least one first opening. A first alignment mark is exposed by a first opening. In at least one support column, an orthogonal projection of a support column on the substrate at least partially overlaps with an orthogonal projection of an opening on the substrate. The plurality of light-emitting devices are disposed on the substrate, and a light-emitting device is located in an installation opening in the reflective layer.

Abstract: A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.

Abstract: Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.

Abstract: The present disclosure provides a flux, a substrate, a manufacturing method thereof, and a device. The flux includes a bulk material and a powdery conductive material mixed in the bulk material, and a volume ratio of the conductive material to the flux is 5% to 10%.

Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.

Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.

Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.