Abstract: A fermented supernatant of Bangia fusco-purpure and Lactobacillus with an alpha-glucosidase inhibitory activity is provided, where a preparation method for the fermented supernatant of Bangia fusco-purpure and Lactobacillus includes the following steps of: S1: mixing Bangia fusco-purpure with water in a mass/volume ratio of 4.45%-5% to obtain a Bangia fusco-purpure suspension; S2: adding glucose in a mass/volume ratio of 2% to the Bangia fusco-purpure suspension, followed by pasteurization; S3: inoculating Lactobacillus delbrueckii or Lactobacillus plantarum in a mass/volume ratio of 4% to obtain a mixed solution of Bangia fusco-purpure and Lactobacillus; S4: fermenting the mixed solution of Bangia fusco-purpure and Lactobacillus at 37° C.

Abstract: An optical module includes a circuit board, a circuit sub-board, a signal processing chip, a first light transceiver assembly, and a second light transceiver assembly. The circuit board is configured to be electrically connected to an outside of the optical module. The circuit sub-board is disposed on the circuit board and electrically connected to the circuit board. The circuit sub-board includes a first body and a connecting hole. The connecting hole runs through an upper surface and a lower surface of the first body. The signal processing chip is disposed on the circuit sub-board. The first light transceiver assembly is disposed on the circuit board and located in the connecting hole. The second light transceiver assembly is disposed on the circuit board and located outside the connecting hole.

Abstract: An optical module includes a circuit board, a substrate, a laser assembly, and a silicon photonic chip. The silicon photonic chip is electrically connected to the circuit board through the substrate so as to ground the silicon photonic chip. The substrate includes a body, a first support step, and a second support step. The first support step is disposed at an end of the body. The second support step is disposed at another end of the body. The circuit board includes a first metal layer and a second metal layer. The first metal layer is disposed on a surface of the circuit board proximate to the first support step and is electrically connected to the first support step. The second metal layer is disposed on a surface of the circuit board proximate to the second support step and is electrically connected to the second support step.