Abstract: A display panel, a method for manufacturing a display panel, and a display apparatus. The display panel includes a display region, a non-display region at least partially surrounding the display region, and further includes a base plate, a wiring layer, a light-emitting layer, and an isolation structure. The wiring layer is located on a side of the base plate and includes a metal layer located in the display region and a signal line layer located in the non-display region. The light-emitting layer is located on a side of the wiring layer away from the base plate and includes a plurality of light-emitting units. The isolation structure is located on a side of the wiring layer away from the base plate and is provided with an isolation opening configured to accommodate the light-emitting unit.

Abstract: A display panel, a display apparatus, and a method for manufacturing a display panel. The display panel includes a base plate, an isolation structure, a light-emitting functional layer, and a plurality of first electrodes, the isolation structure includes a first portion and a second portion; the light-emitting functional layer includes first light-emitting portions and second light-emitting portions; an edge of the first electrode overlaps the first portion, a shortest connecting line between an edge of the first electrode portion and the first edge is a first connecting line, a shortest connecting line between an edge of the second electrode portion and the second edge is a second connecting line, and an angle between the second connecting line and a plane in which the base plate is located is less than an angle between the first connecting line and the plane.

Abstract: A display panel includes a display region and a non-display region connected to the display region. The display panel also includes a base, multiple light-emitting devices, an isolation layer, a bank, and a power wire. A light-emitting device includes a first electrode, a light-emitting function layer, and a second electrode stacked on the base. The isolation layer includes multiple isolation openings. The light-emitting function layer is located in a corresponding isolation opening. The bank is disposed in the non-display region. The projection of the bank on the base surrounds the display region. The power wire is electrically connected to the second electrode. The non-display region includes a first bezel region. The first bezel region includes a first side circuit region located between the bank and the display region. The power wire is disposed in at least part of the non-display region excluding the first side circuit region.

Abstract: A motion plan safety analysis is performed by processing vehicle sensor signals to generate a motion plan which includes a reference trajectory value, by processing the reference trajectory value at a first MPC to generate a first current setpoint and a first plurality of future setpoints, by processing the first plurality of future setpoints at a second MPC to generate a second plurality of future setpoints, by processing the second plurality of future setpoints at the first MPC to generate a first plurality of predicted trajectory states, by processing the first plurality of future setpoints at the second MPC to generate a second plurality of predicted trajectory states, by evaluating the predicted trajectory states to generate a predetermined safety reaction for the vehicle, and by choosing between the first and second current setpoints based on the safety reaction to provide a safest setpoint to a vehicle actuator in the vehicle.

Abstract: A display substrate and a display device are provided. The display substrate includes a plurality of pads, an insulating layer and an inorganic layer located in a peripheral region. At least one of the pads includes a first conductor portion, a second conductor portion and a third conductor portion. The third conductor portion is located on a side of the second conductor portion away from abase substrate and electrically connected to the second conductor portion. The third conductor portion is electrically connected to the second conductor portion through a second via hole disposed in the inorganic layer of the peripheral region. A projection of the first conductor portion on the base substrate is located within a projection of the second via hole on the base substrate.

Abstract: A method for animal detection and repelling includes detecting a plurality of animal characteristics of an animal, the animal characteristics comprising at least an animal size and an animal position. A species of the animal is determined from a bioinformatics database, wherein the bioinformatics database receives the animal size and the animal position. An animal deterrent specific to the species is determined from the bioinformatics database. A repelling signal is generated based on the animal deterrent.

Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.

Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.