Patents by Inventor Yuting NIU

Yuting NIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240028506
    Abstract: A mapping table re-building method, a memory storage device and a memory control circuit unit are disclosed. The method includes: receiving write command from a host system, wherein the write command instructs storing first data to a first logical unit; performing a programming operation according to the write command to store the first data and identification information of the first logical unit to a first physical unit; updating a mapping table in response to the programming operation; detecting a table abnormal event related to the mapping table; reading the identification information of the first logical unit from the first physical unit in response to the table abnormal event; and re-building the mapping table according to the identification information of the first logical unit.
    Type: Application
    Filed: August 8, 2022
    Publication date: January 25, 2024
    Applicant: Hefei Core Storage Electronic Limited
    Inventors: Chih-Ling Wang, Qi-Ao Zhu, Yuting Niu, Yang Zhang
  • Patent number: 11738185
    Abstract: An in-plane metal microneedle array and a manufacturing method therefor is disclosed. A large-size metal sheet is cut into small metal sheets. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves matched with the sizes of the small metal sheets. Through holes are formed at edges around the cover plates. The metal sheets are placed in the grooves and fastened through bolts. The geometry and the size of a sheet microneedle array are designed, and a CAD model of the plane microneedles is built. A wire path is cut according to the CAD model. A few materials are reserved on both sides of substrates of the microneedle array without cutting. The unprocessed parts on both sides of the microneedle substrate are cut to obtain an in-plane metal microneedle array with a plurality of microneedle bodies.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: August 29, 2023
    Assignee: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventors: Guojun Ma, Chengwei Wu, Yuting Niu, Wei Zhang, Yongtao Lv, Xiao Han, Jianli Ma
  • Publication number: 20210138215
    Abstract: An in-plane metal microneedle array and a manufacturing method therefor is disclosed. A large-size metal sheet is cut into small metal sheets. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves matched with the sizes of the small metal sheets. Through holes are formed at edges around the cover plates. The metal sheets are placed in the grooves and fastened through bolts. The geometry and the size of a sheet microneedle array are designed, and a CAD model of the plane microneedles is built. A wire path is cut according to the CAD model. A few materials are reserved on both sides of substrates of the microneedle array without cutting. The unprocessed parts on both sides of the microneedle substrate are cut to obtain an in-plane metal microneedle array with a plurality of microneedle bodies.
    Type: Application
    Filed: May 13, 2019
    Publication date: May 13, 2021
    Inventors: Guojun MA, Chengwei WU, Yuting NIU, Wei ZHANG, Yongtao LV, Xiao HAN, Jianli MA