Patents by Inventor YU TING YANG

YU TING YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cultivation assembly
    Patent number: 11116146
    Abstract: A cultivation assembly has a container, at least one first engaging structure facing outside of the container, and an engaging member. The engaging member is configured to connect the container of another cultivation assembly side by side. The engaging member has two second engaging structures facing opposite directions. Each one of the two second engaging structures is capable of engaging with one of the at least one first engaging structure. The container of the cultivation assembly is capable of being connected to the container of another cultivation assembly side by side via the engaging member and without wasting a lot of labor to move the container.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: September 14, 2021
    Assignee: T.U.I. INDUSTRIAL CO., LTD.
    Inventor: Yu-Ting Yang
  • CULTIVATION ASSEMBLY
    Publication number: 20210029976
    Abstract: A cultivation assembly has a container, at least one first engaging structure facing outside of the container, and an engaging member. The engaging member is configured to connect the container of another cultivation assembly side by side. The engaging member has two second engaging structures facing opposite directions. Each one of the two second engaging structures is capable of engaging with one of the at least one first engaging structure. The container of the cultivation assembly is capable of being connected to the container of another cultivation assembly side by side via the engaging member and without wasting a lot of labor to move the container.
    Type: Application
    Filed: July 29, 2019
    Publication date: February 4, 2021
    Inventor: Yu-Ting Yang
  • Thermally enhanced electronic package
    Patent number: 9307676
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: April 5, 2016
    Assignee: CHIPMOS TECHNOLOGIES INC.
    Inventors: Tzu Hsin Huang, Yu Ting Yang, Hung Hsin Liu, An Hong Liu, Geng Shin Shen, David Wei Wang, Shih Fu Lee
  • THERMALLY ENHANCED ELECTRONIC PACKAGE
    Publication number: 20130294033
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Application
    Filed: July 5, 2013
    Publication date: November 7, 2013
    Inventors: TZU HSIN HUANG, YU TING YANG, HUNG HSIN LIU, AN HONG LIU, GENG SHIN SHEN, DAVID WEI WANG, SHIH FU LEE
  • Thermally enhanced electronic package
    Patent number: 8564954
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: October 22, 2013
    Assignee: Chipmos Technologies Inc.
    Inventors: Tzu Hsin Huang, Yu Ting Yang, Hung Hsin Liu, An Hong Liu, Geng Shin Shen, Wei David Wang, Shih Fu Lee
  • THERMALLY ENHANCED ELECTRONIC PACKAGE
    Publication number: 20110304991
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Application
    Filed: November 18, 2010
    Publication date: December 15, 2011
    Applicant: CHIPMOS TECHNOLOGIES INC.
    Inventors: TZU HSIN HUANG, YU TING YANG, HUNG HSIN LIU, AN HONG LIU, GENG SHIN SHEN, DAVID WEI WANG, SHIH FU LEE