Patents by Inventor YU TING YANG

YU TING YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally enhanced electronic package
    Patent number: 9307676
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: April 5, 2016
    Assignee: CHIPMOS TECHNOLOGIES INC.
    Inventors: Tzu Hsin Huang, Yu Ting Yang, Hung Hsin Liu, An Hong Liu, Geng Shin Shen, David Wei Wang, Shih Fu Lee
  • THERMALLY ENHANCED ELECTRONIC PACKAGE
    Publication number: 20130294033
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Application
    Filed: July 5, 2013
    Publication date: November 7, 2013
    Inventors: TZU HSIN HUANG, YU TING YANG, HUNG HSIN LIU, AN HONG LIU, GENG SHIN SHEN, DAVID WEI WANG, SHIH FU LEE
  • Thermally enhanced electronic package
    Patent number: 8564954
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: October 22, 2013
    Assignee: Chipmos Technologies Inc.
    Inventors: Tzu Hsin Huang, Yu Ting Yang, Hung Hsin Liu, An Hong Liu, Geng Shin Shen, Wei David Wang, Shih Fu Lee
  • THERMALLY ENHANCED ELECTRONIC PACKAGE
    Publication number: 20110304991
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Application
    Filed: November 18, 2010
    Publication date: December 15, 2011
    Applicant: CHIPMOS TECHNOLOGIES INC.
    Inventors: TZU HSIN HUANG, YU TING YANG, HUNG HSIN LIU, AN HONG LIU, GENG SHIN SHEN, DAVID WEI WANG, SHIH FU LEE