Patents by Inventor Yuto HAKAMATA

Yuto HAKAMATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit
    Patent number: 11973146
    Abstract: A semiconductor integrated circuit including: a substrate of a first conductivity type; a buried insulating film provided on the substrate; an active layer of the first conductivity type provided on the buried insulating film; a first impurity region of a second conductivity type formed within the active layer; an electric field relaxation layer of the second conductivity type formed within the active layer and surrounding the first impurity region; a second impurity region of the first conductivity type formed within the active layer and surrounding the electric field relaxation layer; and a groove formed surrounding the second impurity region and reaching the buried insulating film.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 30, 2024
    Assignee: KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO
    Inventors: Kengo Shima, Yoshikazu Kataoka, Kazuya Adachi, Yuto Hakamata
  • SEMICONDUCTOR INTEGRATED CIRCUIT
    Publication number: 20220302323
    Abstract: A semiconductor integrated circuit including: a substrate of a first conductivity type; a buried insulating film provided on the substrate; an active layer of the first conductivity type provided on the buried insulating film; a first impurity region of a second conductivity type formed within the active layer; an electric field relaxation layer of the second conductivity type formed within the active layer and surrounding the first impurity region; a second impurity region of the first conductivity type formed within the active layer and surrounding the electric field relaxation layer; and a groove formed surrounding the second impurity region and reaching the buried insulating film.
    Type: Application
    Filed: October 27, 2020
    Publication date: September 22, 2022
    Inventors: Kengo SHIMA, Yoshikazu KATAOKA, Kazuya ADACHI, Yuto HAKAMATA