Patents by Inventor Yuto Hiyama

Yuto Hiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10062473
    Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 ?m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: August 28, 2018
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Kenichi Inoue, Kozo Ogi, Atsushi Ebara, Yuto Hiyama, Takahiro Yamada, Toshihiko Ueyama
  • Publication number: 20140346413
    Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 ?m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.
    Type: Application
    Filed: January 15, 2013
    Publication date: November 27, 2014
    Inventors: Kenichi Inoue, Kozo Ogi, Atsushi Ebara, Yuto Hiyama, Takahiro Yamada, Toshihiko Ueyama
  • Publication number: 20130153835
    Abstract: When a substrate having a low heat resistance is used, heat treatment at approximately 120° C. at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120° C. regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used.
    Type: Application
    Filed: October 28, 2011
    Publication date: June 20, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takashi Hinotsu, Yuto Hiyama, Toshihiko Ueyama