Abstract: A trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, a conductive salt, and a pH-buffering agent, and further containing an organic compound having 2-4 carbon atoms and three or more chloro groups, and a trivalent chromium plating method using the same provide a practical trivalent chromium plating with enhanced corrosion resistance as compared to the ordinary trivalent chromium plating.

Abstract: A trivalent chromium plating solution that does not cause the problems including the occurrence of deposition failure of the plating and color unevenness, such as a brown stripe pattern, in the plating even though a metal impurity is incorporated into the plating solution, and a trivalent chromium plating method are provided by a trivalent chromium plating solution containing a trivalent chromium compound, a chloride as a conductive salt, a pH buffering agent, and a complexing agent, further containing an unsaturated sulfonic acid compound represented by the following general formula (1) (wherein in the formula (1), R1 represents a hydrocarbon group having a number of carbon atoms of from 1 to 10, hydrogen, or a halogen; R2 represents nothing or a hydrocarbon group having a number of carbon atoms of from 1 to 10; and X represents hydrogen or an alkali metal), and a trivalent chromium plating method using the same.

Abstract: A trivalent chromium plating solution having a high plating deposition rate and being practical is provided with a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, potassium sulfate and ammonium sulfate as a conductive salt, a pH buffer, and a sulfur-containing organic compound, containing a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof as the complexing agent, and containing a combination of saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group as the sulfur-containing organic compound.