Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

Abstract: A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.

Abstract: A multi-layer ceramic capacitor having a weight of 8 mg or more includes a capacitance forming unit and a protective unit. The capacitance forming unit includes internal electrodes that are laminated in a first direction and includes end portions, positions of the end portions in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction. The protective unit covers the capacitance forming unit in the first direction and the second direction and includes an outer surface, a shortest distance between the outer surface and the end portion of an outermost layer in the internal electrodes in the first direction exceeding 10 ?m.

Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

Abstract: A multi-layer ceramic capacitor having a weight of 8 mg or more includes a capacitance forming unit and a protective unit. The capacitance forming unit includes internal electrodes that are laminated in a first direction and includes end portions, positions of the end portions in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction. The protective unit covers the capacitance forming unit in the first direction and the second direction and includes an outer surface, a shortest distance between the outer surface and the end portion of an outermost layer in the internal electrodes in the first direction exceeding 10 ?m.

Abstract: A multi-layer ceramic capacitor having a weight of 8 mg or more includes a capacitance forming unit and a protective unit. The capacitance forming unit includes internal electrodes that are laminated in a first direction and includes end portions, positions of the end portions in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction. The protective unit covers the capacitance forming unit in the first direction and the second direction and includes an outer surface, a shortest distance between the outer surface and the end portion of an outermost layer in the internal electrodes in the first direction exceeding 10 ?m.

Abstract: A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.

Abstract: A multi-layer ceramic capacitor having a weight of 8 mg or more includes a capacitance forming unit and a protective unit. The capacitance forming unit includes internal electrodes that are laminated in a first direction and includes end portions, positions of the end portions in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction. The protective unit covers the capacitance forming unit in the first direction and the second direction and includes an outer surface, a shortest distance between the outer surface and the end portion of an outermost layer in the internal electrodes in the first direction exceeding 10 ?m.