Abstract: Improving the assemblability while improving the heat dissipation effect of the heat-sink. In the rotary electric machine, the ECU unit has the heat-sink that closes the opening of the housing of the motor portion, the circuit board fixed to the lower side of the heat-sink, and the connector assembly fixed to the upper side of the heat-sink with a part of the heat-sink exposed. Thus, the heat of the electronic components of the circuit board can be dissipated to the outside of the rotary electric machine by the heat-sink. Moreover, a connection terminal is provided on the lower surface of the circuit board, and the bus bar terminal portion of the motor portion is press-fitted into the connection terminal. Therefore, the bus bar terminal portion can be connected to the circuit board without being soldered to the circuit board. Therefore, the assemblability of the rotary electric machine can be improved.

Abstract: Increase the heat dissipation effect of the heat sink on the heat generating element. In the rotary electric machine, the portions of the circuit board that are installed in the first and the second installation portion of the heat-sink are configured as non-coated portions, and the non-coated portion is not coated with resist. Therefore, the circuit board can be installed in the first and the second installation portion of the heat-sink without being affected by the variation in the film thickness of the resist. Thus, the gap between the FET mounted on the circuit board and the first to third heat dissipating portion of the heat-sink can be set as small as possible. Therefore, the heat generated by the FET can be efficiently transferred to the heat-sink. As described above, the heat dissipation effect of the heat-sink on the FET can be enhanced.

Abstract: [Object] To provide an electronic apparatus capable of inhibiting a failure due to dropping of a screw from occurring. [Solving Means] An electronic apparatus 100 according to an embodiment of the present invention includes: a casing 10; a cover portion (case cover 20); a circuit board 22; a screw member 80; and a facing member (holding member 60). The cover portion has a first surface and a second surface and is to be attached to an opening portion 11 of the casing 10, the first surface including a screw hole 203 and facing the casing 10, the second surface being opposite to the first surface. The circuit board 22 is to be disposed on the first surface. The screw member 80 includes a head portion 81 and a shank 82 and fixes the circuit board 22 to the cover portion, the head portion 81 engaging with the circuit board 22, the shank 82 including a groove 82s and passing through the circuit board 22, the groove 82s being screwed into the screw hole 203.

Abstract: Increase the heat dissipation effect of the heat sink on the heat generating element. In the rotary electric machine, the portions of the circuit board that are installed in the first and the second installation portion of the heat-sink are configured as non-coated portions, and the non-coated portion is not coated with resist. Therefore, the circuit board can be installed in the first and the second installation portion of the heat-sink without being affected by the variation in the film thickness of the resist. Thus, the gap between the FET mounted on the circuit board and the first to third heat dissipating portion of the heat-sink can be set as small as possible. Therefore, the heat generated by the FET can be efficiently transferred to the heat-sink. As described above, the heat dissipation effect of the heat-sink on the FET can be enhanced.

Abstract: Improving the assemblability while improving the heat dissipation effect of the heat-sink. In the rotary electric machine, the ECU unit has the heat-sink that closes the opening of the housing of the motor portion, the circuit board fixed to the lower side of the heat-sink, and the connector assembly fixed to the upper side of the heat-sink with a part of the heat-sink exposed. Thus, the heat of the electronic components of the circuit board can be dissipated to the outside of the rotary electric machine by the heat-sink. Moreover, a connection terminal is provided on the lower surface of the circuit board, and the bus bar terminal portion of the motor portion is press-fitted into the connection terminal. Therefore, the bus bar terminal portion can be connected to the circuit board without being soldered to the circuit board. Therefore, the assemblability of the rotary electric machine can be improved.

Abstract: A component-mounting device according to an embodiment of the present invention includes a component-mounting board, a connector component, a heat sink, and a first screw portion. The component-mounting board includes a first surface and a second surface opposite to the first surface. The connector component includes a plurality of terminal-fixing portions that fixes a terminal extending in one axis direction orthogonal to the first surface and a base portion that connects between the plurality of terminal-fixing portions and includes an opening portion, the connector component being provided on the first surface. The heat sink faces the second surface and includes a first screw seat that faces the base portion in the one axis direction with the component-mounting board interposed between the first screw seat and the base portion. The first screw portion is disposed inside the opening portion and is engaged with the first screw seat through the component-mounting board.

Abstract: [Object] To provide an electronic apparatus capable of inhibiting a failure due to dropping of a screw from occurring. [Solving Means] An electronic apparatus 100 according to an embodiment of the present invention includes: a casing 10; a cover portion (case cover 20); a circuit board 22; a screw member 80; and a facing member (holding member 60). The cover portion has a first surface and a second surface and is to be attached to an opening portion 11 of the casing 10, the first surface including a screw hole 203 and facing the casing 10, the second surface being opposite to the first surface. The circuit board 22 is to be disposed on the first surface. The screw member 80 includes a head portion 81 and a shank 82 and fixes the circuit board 22 to the cover portion, the head portion 81 engaging with the circuit board 22, the shank 82 including a groove 82s and passing through the circuit board 22, the groove 82s being screwed into the screw hole 203.

Abstract: A component-mounting device according to an embodiment of the present invention includes a component-mounting board, a connector component, a heat sink, and a first screw portion. The component-mounting board includes a first surface and a second surface opposite to the first surface. The connector component includes a plurality of terminal-fixing portions that fixes a terminal extending in one axis direction orthogonal to the first surface and a base portion that connects between the plurality of terminal-fixing portions and includes an opening portion, the connector component being provided on the first surface. The heat sink faces the second surface and includes a first screw seat that faces the base portion in the one axis direction with the component-mounting board interposed between the first screw seat and the base portion. The first screw portion is disposed inside the opening portion and is engaged with the first screw seat through the component-mounting board.

Abstract: [Object] To provide a component-mounting device capable of inhibiting the quality from lowering due to deformation of the circuit board and an electronic apparatus including the same. [Solving Means] A component-mounting device according to an embodiment of the present invention includes a component-mounting board, a connector component, and a heat sink. The component-mounting board includes a first surface and a second surface opposite to the first surface. The connector component is provided on the first surface. The heat sink faces the second surface and includes a first supporting portion that is held in contact with the second surface within a region that faces the connector component with the component-mounting board interposed between the region and the connector component.