Abstract: The disclosure includes: a first lifting step for bonding a wire at a first position (13) with a capillary and for lifting the capillary up to a first height H1 while feeding the wire; a circular arc lifting step for carrying out a circular arc motion for moving the capillary in a circular arc toward a second position (14) by a first distance (L5), and then carrying out a lifting motion for lifting the capillary while feeding the wire; a circular arc motion step for moving the capillary in a circular arc toward the first position (13) by a second distance (L3+L4); a second lifting step for lifting the capillary up to a second height H4; and a looping step for looping the capillary to the second position (14), thereby forming a wire loop having a predetermined height on a substrate by bonding the wire at the second position (14).

Abstract: GUI of an image processing device according to the present invention is a control window which receives a change of an input parameter of spatial tone correction processing and receives an operation of changing five input parameters. In GUI, first input parameters such as a correction method, correction strength, a degree of color enhancement, brightness, and a correction range can be set. The correction method is selected through pull-down menu, and any one or a plurality of methods can be selected from four correction methods such as contrast enhancement, backlight correction, dark-portion correction, and bright-portion correction. The correction strength, degree of color enhancement, brightness, and correction range are designated through slide-bars of which values are respectively set by a user moving sliders within the window in a transverse direction. Value displays display designated values of the correction strength, the degree of color enhancement, the brightness, and the correction range.

Abstract: The disclosure includes: a first lifting step for bonding a wire at a first position (13) with a capillary and for lifting the capillary up to a first height H1 while feeding the wire; a circular arc lifting step for carrying out a circular arc motion for moving the capillary in a circular arc toward a second position (14) by a first distance (L5), and then carrying out a lifting motion for lifting the capillary while feeding the wire; a circular arc motion step for moving the capillary in a circular arc toward the first position (13) by a second distance (L3+L4); a second lifting step for lifting the capillary up to a second height H4; and a looping step for looping the capillary to the second position (14), thereby forming a wire loop having a predetermined height on a substrate by bonding the wire at the second position (14).

Abstract: GUI of an image processing device according to the present invention is a control window which receives a change of an input parameter of spatial tone correction processing and receives an operation of changing five input parameters. In GUI, first input parameters such as a correction method, correction strength, a degree of color enhancement, brightness, and a correction range can be set. The correction method is selected through pull-down menu, and any one or a plurality of methods can be selected from four correction methods such as contrast enhancement, backlight correction, dark-portion correction, and bright-portion correction. The correction strength, degree of color enhancement, brightness, and correction range are designated through slide-bars of which values are respectively set by a user moving sliders within the window in a transverse direction. Value displays display designated values of the correction strength, the degree of color enhancement, the brightness, and the correction range.

Abstract: A semiconductor device includes: a lead frame; a semiconductor element held by the lead frame; a frame body which is formed on the lead frame to surround the semiconductor element, cover a side surface of the lead frame, and expose a bottom surface of the lead frame; and a protective resin filling a region surrounded by the frame body. The lead frame includes an uneven part formed in a section which is part of an upper surface of the lead frame, and is covered with the frame body.

Abstract: A semiconductor device includes a lead frame, a first semiconductor element mounted on the lead frame, a frame-like member formed on the lead frame, surrounding the first semiconductor element, and a protective resin filling a space surrounded by the frame-like member. The lead frame has an external terminal protruding outside the frame-like member. The external terminal has a barrier portion which is located at an end portion thereof protruding from the frame-like member and rises from a top surface of the external terminal.