Abstract: According to a mode of the present invention, a method of manufacturing an electronic component includes: preparing a component main-body 110 including a first surface having an electrode-formed region having a plurality of bump electrodes 103, a second surface opposite to the first surface, and side peripheral surfaces connecting the first surface and the second surface; forming a mask section M1 on at least a peripheral portion of the first surface, the mask section surrounding the electrode-formed region, a height of the mask section being equal to or more than a height of the plurality of bump electrodes; bonding the mask section of the first surface to an adhesive layer 30 on a holder for holding a component; forming a protective film 105 on the component main-body, the protective film covering the second surface and the side peripheral surfaces; and removing the mask section M1 from the first surface.

Abstract: According to an embodiment of the present invention, the workpiece holding body 20 for surface processing includes the holder 21 and the adhesive sheet 22. The adhesive sheet 22 includes the first surface 22a (the first adhesive layer 221) and the second surface 22b (the second adhesive layer 222), the first surface 22a (the first adhesive layer 221) being bonded to the holder 21 at a first adhesive force, the second surface 22b (the second adhesive layer 222) being capable of holding a workpiece (the component main-body 110) at a second adhesive force, the second adhesive force being higher than the first adhesive force.

Abstract: According to a mode of the present invention, a method of manufacturing an electronic component includes: preparing a component main-body 110 including a first surface having an electrode-formed region having a plurality of bump electrodes 103, a second surface opposite to the first surface, and side peripheral surfaces connecting the first surface and the second surface; forming a mask section M1 on at least a peripheral portion of the first surface, the mask section surrounding the electrode-formed region, a height of the mask section being equal to or more than a height of the plurality of bump electrodes; bonding the mask section of the first surface to an adhesive layer 30 on a holder for holding a component; forming a protective film 105 on the component main-body, the protective film covering the second surface and the side peripheral surfaces; and removing the mask section M1 from the first surface.