Patents by Inventor Yuuichi Eriyama
Yuuichi Eriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9543079Abstract: The present invention relates to a production process for an electrode material, an electrode and an electric storage device, and the production process for an electrode material comprises a step of heating a polymer having a silicon-containing unit and a silicon-non-containing unit.Type: GrantFiled: August 13, 2014Date of Patent: January 10, 2017Assignee: JSR CORPORATIONInventors: Ryo Tanaka, Kouji Senoo, Takahiro Shimizu, Yukio Hosaka, Fujio Sakurai, Satoshi Shimobaba, Motoki Okaniwa, Nobuyuki Miyaki, Yuuichi Eriyama
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Publication number: 20150048273Abstract: The present invention relates to a production process for an electrode material, an electrode and an electric storage device, and the production process for an electrode material comprises a step of heating a polymer having a silicon-containing unit and a silicon-non-containing unit.Type: ApplicationFiled: August 13, 2014Publication date: February 19, 2015Applicant: JSR CORPORATIONInventors: Ryo TANAKA, Kouji Senoo, Takahiro Shimizu, Yukio Hosaka, Fujio Sakurai, Satoshi Shimobaba, Motoki Okaniwa, Nobuyuki Miyaki, Yuuichi Eriyama
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Patent number: 7569335Abstract: There is provided a photosensitive resin composition for forming an optical waveguide which has high shape precision and excellent transmission characteristics under high temperature and high humidity. A composition of the present invention contains (A) a polymer having structures represented by the following general formulae (I) and (2) (in the formulae, each of R1 and R2 is independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R3 is an organic group containing a radical-polymerizable reactive group; X is a single bond or a bivalent organic group; and Y is a non-polymerizable organic group), (B) a compound having at least one ethylenic unsaturated group in the molecule thereof, having a molecular weight below 1,000 and having a boiling point of at least 130° C. at 0.1 MPa, and (C) a photoradical polymerization initiator.Type: GrantFiled: February 19, 2008Date of Patent: August 4, 2009Assignee: JSR CorporationInventors: Yukio Maeda, Yuuichi Eriyama
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Patent number: 7394965Abstract: A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portion 5 of an optical waveguide 1, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, R1 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.Type: GrantFiled: February 23, 2005Date of Patent: July 1, 2008Assignee: JSR CorporationInventors: Tomohiro Utaka, Hideaki Takase, Yuuichi Eriyama
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Publication number: 20080145016Abstract: There is provided a photosensitive resin composition for forming an optical waveguide which has high shape precision and excellent transmission characteristics under high temperature and high humidity. A composition of the present invention contains (A) a polymer having structures represented by the following general formulae (1) and (2) (in the formulae, each of R1 and R2 is independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R3 is an organic group containing a radical-polymerizable reactive group; X is a single bond or a bivalent organic group; and Y is a non-polymerizable organic group), (B) a compound having at least one ethylenic unsaturated group in the molecule thereof, having a molecular weight below 1,000 and having a boiling point of at least 130° C. at 0.1 MPa, and (C) a photoradical polymerization initiator.Type: ApplicationFiled: February 19, 2008Publication date: June 19, 2008Applicant: JSR CorporationInventors: Yukio MAEDA, Yuuichi Eriyama
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Patent number: 7376328Abstract: A photosensitive resin composition for optical waveguide formation, comprising: (A) a di(meth)acrylate having the structure represented by the following general formula (1): (wherein R1 is —(OCH2CH2)m—, —(OCH(CH3)CH2)m—, or —OCH2CH(OH)CH2—; X is —C(CH3)2—, —CH2—, —O—, or —SO2—; Y is a hydrogen atom or a halogen atom; m is an integer of 0 to 4); (B) a mono(meth)acrylate having the structure represented by the following general formula (2): (wherein R2 is —(OCH2CH2)p—, —(OCH(CH3)CH2)p—, or —OCH2CH(OH)CH2—; Y is a hydrogen atom, a halogen atom, Ph-C(CH3)2—, Ph-, or an alkyl group having 1 to 20 carbon atoms; p is an integer of 0 to 4; Ph is a phenyl group); and (C) a photoradical polymerization initiator. The composition has excellent patterning ability, refractive index, heat resistance, and transmission characteristic.Type: GrantFiled: September 30, 2003Date of Patent: May 20, 2008Assignee: JSR CorporationInventors: Hideaki Takase, Yuuichi Eriyama
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Patent number: 7366381Abstract: An optical waveguide chip including a core portion as an optical waveguide, a clad portion composed of a lower clad layer and an upper clad layer, and an optical fiber guide portion which is formed integrally with the clad portion for positioning a single-mode optical fiber which is to be connected with the core portion. Each portion of the optical waveguide chip is formed by creating a layer of a radiation-sensitive polysiloxane composition by photolithography. At least two kinds of radiation-sensitive polysiloxane compositions are used so that the core portion has a higher refractive index than the clad portion.Type: GrantFiled: March 26, 2004Date of Patent: April 29, 2008Assignee: JSR CorporationInventors: Kentarou Tamaki, Hideaki Takase, Yuuichi Eriyama, Shinji Ohba, Hideyuki Fujiwara
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Publication number: 20080015280Abstract: A radiation-sensitive composition for forming optical waveguides, which can stably exhibit low transmission loss, high heat resistance, and high adhesion to a substrate such as a silicon wafer and the like, over a long period of time even under severe conditions is provided. The composition comprises: from 5 to 50 mass percent of a (meth)acrylate having an adamantyl group represented by general formula (1) or (2); (in the formula, R1 is a hydrogen atom or a methyl group; R2 is —CH2CH2—, —CH2CH(CH3)—, or —CH2CH(OH)CH2—; n is an integer from 0 to 10) (in the formula, R1 is a hydrogen atom or a methyl group; R2 is —CH2CH2—, —CH2CH(CH3)—, or —CH2CH(OH)CH2—; R3 is a hydrogen atom, a methyl group, or an ethyl group; n is an integer from 0 to 10); from 40 to 94.99 mass percent of other photopolymerizable compounds; and from 0.01 to 10 mass percent of a photopolymerization initiator.Type: ApplicationFiled: February 23, 2005Publication date: January 17, 2008Applicant: JSR CorporationInventors: Hideaki Takase, Yuuichi Eriyama
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Publication number: 20070223868Abstract: A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portion 5 of an optical waveguide 1, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, R1 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.Type: ApplicationFiled: February 23, 2005Publication date: September 27, 2007Applicant: JSR CorporationInventors: Tomohiro Utaka, Hideaki Takase, Yuuichi Eriyama
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Publication number: 20070189671Abstract: An optical waveguide chip having an optical waveguide which can keep good transmission characteristics stably over a long period of time without separations or cracks even in severe use conditions, and an optical fiber guide portion formed without cracks firmly with a shape and a size corresponding to those of an optical fiber is provided. An optical waveguide chip 1 has a support 2, an optical waveguide 3 having a core portion 7, clad layers 6 and 8, an optical fiber guide portion 4 for positioning an optical fiber to be connected with the optical waveguide 3, and a cover member (glass plate) 5. The optical waveguide 3 is made of a radiation-sensitive polysiloxane composition. The optical fiber guide portion 4 is made of the same or a different radiation-sensitive polysiloxane composition as/from the material of the optical waveguide 3. The optical waveguide 3 and the optical fiber guide portion 4 are formed by separate processes.Type: ApplicationFiled: February 23, 2005Publication date: August 16, 2007Applicant: SR CorporationInventors: Kentarou Tamaki, Hideaki Takase, Jun Huangfu, Yuuichi Eriyama
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Publication number: 20070104439Abstract: A polymer optical waveguide of the present invention has a lower clad layer, a core layer and an upper clad layer that are provided on a substrate, and a cover member that covers at least one part of the upper clad layer. The upper clad layer and the cover member are fixed together by a radiation-curable adhesive. The cover member comprises quartz or glass. According to this polymer optical waveguide, moisture absorption through the upper clad layer can be prevented, deterioration in adhesive property to the substrate or changes in characteristics due to moisture absorption of materials can be suppressed even under severe environmental conditions, and there is no deterioration in optical characteristics between before and after reliability tests, and hence sufficient reliability can be secured, and the polymer optical waveguide has stable transmission characteristics.Type: ApplicationFiled: May 28, 2004Publication date: May 10, 2007Applicant: JSR CORPORATIONInventors: Kentarou Tamaki, Hideaki Takase, Yuuichi Eriyama
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Publication number: 20070081782Abstract: A radiation-sensitive resin composition for optical waveguides having high dimensional accuracy, good transmission characteristics, and excellent bending resistance is provided. The composition comprises: (A) a poly(meth)acrylate having a repeating unit represented by the following general formula (1) (in the formula, R1 is a hydrogen atom or a methyl group, R3 is a (meth)acryloyl group, X is a bivalent organic group); (B) an urethane (meth)acrylate compound which is a reaction product of a polyester polyol compound, a polyisocyanate compound, and a (meth) acrylate having a hydroxyl group; (C) a compound having at least one ethylenically unsaturated group and having a boiling point of 130 degree C. or higher under 0.1 MPa other than components (A) and (B); and (D) a photo-radical polymerization initiator. The composition was used as the material for the lower clad layer 12 of the optical waveguide 24, and the like.Type: ApplicationFiled: September 21, 2006Publication date: April 12, 2007Applicant: JSR CorporationInventors: Yukio Maeda, Yuuichi Eriyama
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Patent number: 7162131Abstract: A radiation-curable composition containing (A) hydrolyzates of hydrolyzable silane compounds represented by general formula (1): (R1)p(R2)qSi(X)4-p-q (wherein R1 is a non-hydrolyzable organic group having 1 to 12 carbon atoms that contains fluorine atoms, R2 is a non-hydrolyzable organic group having 1 to 12 carbon atoms (but excluding ones that contain fluorine atoms), X is a hydrolyzable group, p is an integer of 1 or 2, and q is an integer of 0 or 1) and condensates of such hydrolyzates, and (B) a photo acid generator, wherein the ratio of silanol (Si—OH) groups in the composition is 0.1 to 0.5 out of all the bonding groups on Si. With such a composition, the waveguide loss is low for light having a wavelength in a broad range from the visible region to the near infrared region, and moreover the cracking resistance, the patterning ability upon irradiation with radiation, and so on are excellent.Type: GrantFiled: October 20, 2003Date of Patent: January 9, 2007Assignee: JSR CorporationInventors: Hideaki Takase, Kentarou Tamaki, Jun Huangfu, Tomohiro Utaka, Yuuichi Eriyama
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Publication number: 20060165362Abstract: A radiation-curable composition containing (A) hydrolyzates of hydrolyzable silane compounds represented by general formula (1): (R1)p(R2)qSi(X)4-p-q (wherein R1 is a non-hydrolyzable organic group having 1 to 12 carbon atoms that contains fluorine atoms, R2 is a non-hydrolyzable organic group having 1 to 12 carbon atoms (but excluding ones that contain fluorine atoms), X is a hydrolyzable group, p is an integer of 1 or 2, and q is an integer of 0 or 1) and condensates of such hydrolyzates, and (B) a photo acid generator, wherein the ratio of silanol (Si—OH) groups in the composition is 0.1 to 0.5 out of all the bonding groups on Si. With such a composition, the waveguide loss is low for light having a wavelength in a broad range from the visible region to the near infrared region, and moreover the cracking resistance, the patterning ability upon irradiation with radiation, and so on are excellent.Type: ApplicationFiled: October 20, 2003Publication date: July 27, 2006Applicant: JSR CORPORATIONInventors: Hideaki Takase, Kentarou Tamaki, Jun Huangfu, Tomohiro Utaka, Yuuichi Eriyama
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Publication number: 20060088257Abstract: There is provided a photosensitive resin composition for forming an optical waveguide which has high shape precision and excellent transmission characteristics under high temperature and high humidity. A composition of the present invention contains (A) a polymer having structures represented by the following general formulae (1) and (2) (in the formulae, each of R1 and R2 is independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R3is an organic group containing a radical-polymerizable reactive group; X is a single bond or a bivalent organic group; and Y is a non-polymerizable organic group), (B) a compound having at least one ethylenic unsaturated group in the molecule thereof, having a molecular weight below 1,000 and having a boiling point of at least 130° C. at 0.1 MPa, and (C) a photoradical polymerization initiator.Type: ApplicationFiled: October 21, 2005Publication date: April 27, 2006Applicant: JSR CorporationInventors: Yukio Maeda, Yuuichi Eriyama
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Publication number: 20060008222Abstract: A photosensitive resin composition for optical waveguide formation, comprising: (A) a di(meth)acrylate having the structure represented by the following general formula (1): (wherein R1 is —(OCH2CH2)m—, —(OCH(CH3)CH2)m—, or —OCH2CH(OH)CH2—; X is —C(CH3)2—, —CH2—, —O—, or —SO2—; Y is a hydrogen atom or a halogen atom; m is an integer of 0 to 4); (B) a mono(meth)acrylate having the structure represented by the following general formula (2): (wherein R2 is —(OCH2CH2)p—, —(OCH(CH3)CH2)p—, or —OCH2CH(OH)CH2—; Y is a hydrogen atom, a halogen atom, Ph-C(CH3)2—, Ph-, or an alkyl group having 1 to 20 carbon atoms; p is an integer of 0 to 4; Ph is a phenyl group); and (C) a photoradical polymerization initiator. The composition has excellent patterning ability, refractive index, heat resistance, and transmission characteristic.Type: ApplicationFiled: September 30, 2003Publication date: January 12, 2006Applicant: JSR CorporationInventors: Hideaki Takase, Yuuichi Eriyama