Patents by Inventor Yuuichi Hosoda

Yuuichi Hosoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making cushion material from foam slabs and comminuted soft foam scrap
    Patent number: 4443286
    Abstract: A cushion material and method of making the same, in which a soft polyurethane foam is cut into a slab in a predetermined form; applied to or injected into this polyurethane foam slab at a predetermined portion thereof a bonding agent or forming keeping binder which has a property to be solidified in reaction under certain conditions; said slab is shaped as compressed in a pair of forming dies into a predetermined cubic form, or integrally bonded on a cushion layer constituted by said slab of polyurethane foam another cushion layer made of polyurethane foam chips shaped in a predetermined cubic form by chopping or comminuting soft polyurethane foam scrap into chips, applying a bonding agent to them, and compressing them in a pair of forming dies.
    Type: Grant
    Filed: November 19, 1981
    Date of Patent: April 17, 1984
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Hisashi Ikeda, Yuuichi Hosoda
  • Cushion materials and method of making same
    Patent number: 4374885
    Abstract: A cushion material and method of making the same, in which a soft polyurethane foam is cut into a slab in a predetermined form; applied to or injected into this polyurethane foam slab at a predetermined portion thereof a bonding agent or forming keeping binder which has a property to be solidified in reaction under certain conditions; said slab is shaped as compressed in a pair of forming dies into a predetermined cubic form, or integrally bonded on a cushion layer constituted by said slab of polyurethane foam another cushion layer made of polyurethane foam chips shaped in a predetermined cubic form by chopping or comminuting soft polyurethane foam scrap into chips, applying a bonding agent to them, and compressing them in a pair of forming dies.
    Type: Grant
    Filed: January 19, 1981
    Date of Patent: February 22, 1983
    Assignee: Ikeda Bussan Co., Ltd.
    Inventors: Hisashi Ikeda, Yuuichi Hosoda