Patents by Inventor Yuuichi IWASE

Yuuichi IWASE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160251116
    Abstract: A labeled hollow molded container and molding method thereof are disclosed. The container presents good impact resistance when falling down. The main body wall thickness variable X of the container section, which is calculated from the optical microscopic observation, meets the following formula (1), ?50?X<T . . . formula (1), the main body wall thickness variable (?m): X=Z?Y, the label thickness at the labeled part: T, the container thickness at the labeled part: Y, the container thickness at the unlabeled part: Z.
    Type: Application
    Filed: August 12, 2014
    Publication date: September 1, 2016
    Applicant: YUPO CORPORATION
    Inventors: Takashi FUNATO, Takahiko UEDA, Yuuichi IWASE
  • Publication number: 20160046101
    Abstract: An in-mold label having a heat sealing layer formed on one surface of an olefinic resin film, wherein the heat sealing layer contains a thermoplastic resin satisfying (1) at least one crystallization peak occurs between 85 to 110° C. in differential scanning calorimetry and (2) the hot tack force at 130° C. is 120 to 350 gf/cm2, can reduce defects in a labeled container even when the container is produced in a short cycle time.
    Type: Application
    Filed: March 25, 2014
    Publication date: February 18, 2016
    Applicant: YUPO CORPORATION
    Inventors: Takahiko UEDA, Yuuichi IWASE