Patents by Inventor Yuuichi Kawaguchi

Yuuichi Kawaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420184
    Abstract: Disclosed herein is a coil component that includes an element body having a mounting surface, a coil part embedded in the element body, and a first conductor post embedded in the element body. The first conductor post has a first end connected to the coil part and a second end exposed from the mounting surface. A surface of the element body on the mounting surface side has a recess from a surface of the first conductor post.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 28, 2023
    Inventors: Yuuichi KAWAGUCHI, Naoaki FUJII, Tomonaga NISHIKAWA, Liyi CHEN, Rui SAKUMA
  • Publication number: 20230420176
    Abstract: Disclosed herein is a coil component that includes a magnetic element body, and a coil part embedded in the magnetic element body. The magnetic element body includes a first region covering the coil part from one side in a coil axis direction, a second region covering the coil part from other side in the coil axis direction, and a third region positioned in an inner diameter area of the coil part so as to connect the first and second regions. The height of the coil part in the coil axis direction decreases toward the inner diameter area.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 28, 2023
    Inventors: Yuuichi KAWAGUCHI, Naoaki FUJII, Tomonaga NISHIKAWA, Liyi CHEN, Mitsuo NATORI
  • Publication number: 20230368969
    Abstract: To prevent a short-circuit failure by controlling the flow of a solder in a surface-mount type coil component. A coil component includes a coil part in which conductor layers and interlayer insulating layers are alternately stacked. The conductor layers respectively have coil conductor patterns embedded in the coil part and electrode patterns exposed from the coil part. The interlayer insulating layers each protrude from the plurality of electrode patterns at a part between the electrode patterns, and the flow of a solder in the stacking direction is suppressed by the protruding parts. This makes it possible to prevent a short-circuit failure due to the flow of a solder in the stacking direction.
    Type: Application
    Filed: September 7, 2021
    Publication date: November 16, 2023
    Inventors: Yuuichi KAWAGUCHI, Naoaki FUJII, Tomonaga NISHIKAWA
  • Publication number: 20230352234
    Abstract: A coil component includes: a magnetic element body made of resin containing conductive magnetic powder; a coil part 20 obtained by alternately stacking a plurality of conductor layers and a plurality of interlayer insulating layers, the plurality of conductor layers respectively including coil conductor patterns embedded in the magnetic element body and electrode patterns exposed from the magnetic element body; external terminals provided respectively on the electrode patterns and electrode patterns; and a protective insulating layer covering the magnetic element body in such a manner as to expose the external terminals therethrough. The magnetic element body is thus covered with the protective insulating layer, so that it is possible to prevent adhesion of plating to an unnecessary portion and exposure of the coil conductor patterns even when the surfaces of the external terminals are subjected to electrolytic plating.
    Type: Application
    Filed: September 7, 2021
    Publication date: November 2, 2023
    Inventors: Yuuichi KAWAGUCHI, Mitsuo NATORI, Azuma SATOH, Naoaki FUJII, Tomonaga NISHIKAWA
  • Publication number: 20230238170
    Abstract: Disclosed herein is a coil component that includes: a coil part having a structure in which alternately stacking a plurality of conductor layers each including a spiral coil pattern and a plurality of insulating layers; a first magnetic layer disposed in an inner diameter area of the coil part, in an outside area of the coil part, and on one side in an axial direction of the coil part; and a second magnetic layer disposed on other side in the axial direction of the coil part. Each of the first and second magnetic layers comprises a composite magnetic material containing magnetic fillers and binder resin. The content of the magnetic filers in the first magnetic layer is higher than the content of the magnetic fillers in the second magnetic layer.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 27, 2023
    Inventors: Yuuichi KAWAGUCHI, Mitsuo NATORI, Azuma SATOH
  • Publication number: 20230170135
    Abstract: Disclosed herein is a chip-type coil component that includes a magnetic element body, a coil pattern embedded in the magnetic element body, and a terminal electrode connected to the coil pattern and exposed to a mounting surface of the magnetic element body. A recessed part obtained by removing a part of the magnetic element body is formed in an upper surface of the magnetic element body positioned on a side opposite the mounting surface to function as a directional mark.
    Type: Application
    Filed: November 16, 2022
    Publication date: June 1, 2023
    Inventors: Yuuichi KAWAGUCHI, Masanori SUZUKI, Tomonaga NISHIKAWA, Mitsuo NATORI, Osamu NAKADA
  • Publication number: 20230071379
    Abstract: To achieve a high inductance value while reducing the entire thickness in a coil component having a structure in which spiral coil patterns are stacked. A coil component includes: a coil part having a structure in which interlayer insulating films and spirally wound coil patterns are alternately stacked in the axial direction of the coil component; and magnetic element members embedding therein the coil part. The interlayer insulating film covering, from one end side in the axial direction, one coil pattern positioned at the one end in the axial direction is higher in permeability than the interlayer insulating films. Thus, the one coil pattern positioned at the end portion is covered with the interlayer insulating film having a high permeability, so that it is possible to achieve a high inductance value while reducing the entire thickness.
    Type: Application
    Filed: February 10, 2021
    Publication date: March 9, 2023
    Inventors: Yuuichi KAWAGUCHI, Tomonaga NISHIKAWA, Takuya TAKEUCHI, Mitsuo NATORI
  • Publication number: 20220375675
    Abstract: A coil-embedded magnetic core capable of achieving improvements both in insulation and initial magnetic permeability, and coil devices thereof. The coil-embedded magnetic core embedding a coil made of a conductor, including magnetic powder and a resin, in which the coil-embedded magnetic core further includes a modifier.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 24, 2022
    Applicant: TDK CORPORATION
    Inventors: Kentaro SAITO, Shota OTSUKA, Kyohei TONOYAMA, Tomonaga NISHIKAWA, Mitsuo NATORI, Yuuichi KAWAGUCHI, Junichi SHIMAMURA
  • Publication number: 20220375681
    Abstract: A coil component has a magnetic element body made of resin containing magnetic particles, a coil part embedded in the magnetic element body, conductor posts which are embedded in the magnetic element body and whose one ends are connected to the coil part and the other ends are exposed from the magnetic element body, an insulating layer interposed between the conductor posts and the magnetic element body, and other insulating layers interposed between the coil part and the magnetic element body. Since the insulating layer is interposed between the conductor posts and the magnetic element body, it is possible to ensure insulation performance between the conductor posts and the magnetic element body and to prevent the occurrence of peeling therebetween.
    Type: Application
    Filed: September 24, 2020
    Publication date: November 24, 2022
    Inventors: Takuya TAKEUCHI, Yuuichi KAWAGUCHI, Masanori SUZUKI, Naoaki FUJII
  • Patent number: 11488772
    Abstract: Provided is a coil component that includes a coil part having a planar coil that includes a winding section and an insulating section covering the winding section, and a magnetic resin layer including a magnetic filler and configured to cover the coil part. The magnetic resin layer has a first magnetic resin layer that is in contact with the coil part and a second magnetic resin layer that is laminated on the first magnetic resin layer. The second magnetic resin layer constitutes a principal surface of the magnetic resin layer, and a maximum particle size of the magnetic filler contained in the second magnetic resin layer is larger than that of the magnetic filler contained in the first magnetic resin layer.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: November 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuuichi Kawaguchi, Masanori Suzuki, Naoaki Fujii
  • Patent number: 11482357
    Abstract: Disclosed herein is a coil component that includes: a magnetic element body containing magnetic powder, the magnetic element body having first and second surfaces; a coil conductor embedded in the magnetic element body; and an external terminal connected to the coil conductor and exposed on the first surface of the magnetic element body. The second surface of the magnetic element body is free from the external terminal. The first surface is greater in surface roughness than the second surface.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: October 25, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuuichi Kawaguchi, Masanori Suzuki, Naoaki Fujii, Tomonaga Nishikawa
  • Patent number: 11450475
    Abstract: A coil component includes: a first magnetic resin layer in a lower area; a second magnetic resin layer in an inner diameter area surrounded by a coil pattern, an outer peripheral area that surrounds the coil pattern, and an upper area; and an insulating gap layer between the first and second magnetic resin layers. A part of the insulating gap layer positioned between the first magnetic resin layer and a part of the second magnetic resin layer positioned in the inner diameter area is curved in the axial direction. A magnetic substrate need not be used. The insulating gap layer is provided, allowing the insulating gap layer to function as a magnetic gap. The insulating gap layer is curved in the axial direction, so that a contact area between the insulating gap layer and the first and second magnetic resin layers are increased to enhance adhesion therebetween.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: September 20, 2022
    Assignee: TDK CORPORATION
    Inventors: Masanori Suzuki, Yuuichi Kawaguchi, Naoaki Fujii, Tomonaga Nishikawa
  • Publication number: 20210005377
    Abstract: A coil component includes: a first magnetic resin layer in a lower area; a second magnetic resin layer in an inner diameter area surrounded by a coil pattern, an outer peripheral area that surrounds the coil pattern, and an upper area; and an insulating gap layer between the first and second magnetic resin layers. A part of the insulating gap layer positioned between the first magnetic resin layer and a part of the second magnetic resin layer positioned in the inner diameter area is curved in the axial direction. A magnetic substrate need not be used. The insulating gap layer is provided, allowing the insulating gap layer to function as a magnetic gap. The insulating gap layer is curved in the axial direction, so that a contact area between the insulating gap layer and the first and second magnetic resin layers are increased to enhance adhesion therebetween.
    Type: Application
    Filed: August 10, 2018
    Publication date: January 7, 2021
    Inventors: Masanori SUZUKI, Yuuichi KAWAGUCHI, Naoaki FUJII, Tomonaga NISHIKAWA
  • Publication number: 20190326041
    Abstract: Disclosed herein is a coil component that includes: a magnetic element body containing magnetic powder, the magnetic element body having first and second surfaces; a coil conductor embedded in the magnetic element body; and an external terminal connected to the coil conductor and exposed on the first surface of the magnetic element body. The second surface of the magnetic element body is free from the external terminal. The first surface is greater in surface roughness than the second surface.
    Type: Application
    Filed: April 24, 2019
    Publication date: October 24, 2019
    Applicant: TDK CORPORATION
    Inventors: Yuuichi KAWAGUCHI, Masanori SUZUKI, Naoaki FUJII, Tomonaga NISHIKAWA
  • Publication number: 20190088413
    Abstract: Provided is a coil component that includes a coil part having a planar coil that includes a winding section and an insulating section covering the winding section, and a magnetic resin layer including a magnetic filler and configured to cover the coil part. The magnetic resin layer has a first magnetic resin layer that is in contact with the coil part and a second magnetic resin layer that is laminated on the first magnetic resin layer. The second magnetic resin layer constitutes a principal surface of the magnetic resin layer, and a maximum particle size of the magnetic filler contained in the second magnetic resin layer is larger than that of the magnetic filler contained in the first magnetic resin layer.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 21, 2019
    Applicant: TDK CORPORATION
    Inventors: Yuuichi KAWAGUCHI, Masanori SUZUKI, Naoaki FUJII
  • Patent number: 7824584
    Abstract: A stamper manufacturing method comprises: forming a stamper body so as to have a concave/convex pattern on one surface and a crystalline structure on at least a side toward the other surface; forming a layer having an amorphous structure on the other surface side of the stamper body; and polishing a surface of the layer having the amorphous structure. A resin molded article manufacturing method includes an injection molding process using the stamper as a prototype so as to transfer the concave/convex pattern of the stamper to a resin material. A stamper comprises a stamper body which is formed so as to have a concave/convex pattern on one surface and have a crystalline structure on at least a side toward the other surface. In the stamper, a layer having an amorphous structure and a surface of which is polished is formed on the other surface side of the stamper body.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: November 2, 2010
    Assignee: TDK Corporation
    Inventors: Yuuichi Kawaguchi, Shuichi Okawa, Katsumichi Tagami
  • Publication number: 20090286045
    Abstract: A stamper manufacturing method comprises: forming a stamper body so as to have a concave/convex pattern on one surface and a crystalline structure on at least a side toward the other surface; forming a layer having an amorphous structure on the other surface side of the stamper body; and polishing a surface of the layer having the amorphous structure. A resin molded article manufacturing method includes an injection molding process using the stamper as a prototype so as to transfer the concave/convex pattern of the stamper to a resin material. A stamper comprises a stamper body which is formed so as to have a concave/convex pattern on one surface and have a crystalline structure on at least a side toward the other surface. In the stamper, a layer having an amorphous structure and a surface of which is polished is formed on the other surface side of the stamper body.
    Type: Application
    Filed: May 5, 2009
    Publication date: November 19, 2009
    Applicant: TDK CORPORATION
    Inventors: Yuuichi Kawaguchi, Shuichi Okawa, Katsumichi Tagami
  • Patent number: 7204188
    Abstract: A stamper with a sharp uneven pattern for manufacturing high precision information media and a method of manufacturing a stamper. The method includes (1) manufacturing a photoresist master by forming a light absorption layer and a photoresist layer on substrate, (2) forming a latent image on the photoresist layer, and an uneven pattern in the photoresist layer by developing the latent image, (3) forming a Ni thin film on the uneven pattern by electroless plating, (4) forming a Ni film on the Ni thin film, and (5) removing the Ni thin film and the Ni film from the photoresist master. The method also includes, prior to the step of forming the Ni thin film on the photoresist layer, a metal catalyst being provided on the surface of the uneven pattern, the metal catalyst being activated, and the surface of the uneven pattern being washed with ultra pure water.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: April 17, 2007
    Assignee: TDK Corporation
    Inventors: Hisaji Oyake, Hiroaki Takahata, Kenji Yoneyama, Yuuichi Kawaguchi
  • Publication number: 20050286401
    Abstract: In a ROM-type optical recording medium including a substrate 2 having a plurality of concave pits 2a formed on a surface thereof, a light transmission layer 4, and a reflective layer 3 formed between the substrate 2 and the light transmission layer 4, and adapted to reproduce data by causing a laser beam to be irradiated through the light transmission layer 4, the concave pits 2a on the surface of the substrate 2 has a larger length than a basic length BL to be determined according to data to be recorded, and the length of spaces 2b between the concave pits 2a adjacent to each other in a track direction has a smaller length than the basic length BL.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 29, 2005
    Applicant: TDK CORPORATION
    Inventors: Hisaji Oyake, Yuuichi Kawaguchi, Jin Kutsukake, Kenichi Kitamura, Takashi Koshimizu, Koji Mishima
  • Publication number: 20050118534
    Abstract: A stamper with a sharp uneven pattern is obtained, and high precision information media can be manufactured using this stamper. A photoresist master 100 is manufactured by forming a light absorption layer 103 with a film thickness T that satisfies T>180 (nm) and a photoresist layer 104, in that order, on top of a substrate 102, and then forming an uneven pattern 106 in the photoresist layer 104 by forming and developing a latent image, and a stamper 120 is manufactured by forming a Ni thin film 108 on top of the uneven pattern 106 of the photoresist master 100 by electroless plating, forming a Ni film 110 on top of this Ni thin film 108 by electroforming, and then separating the Ni thin film 108 and the Ni film 110 from the photoresist master 100.
    Type: Application
    Filed: January 6, 2003
    Publication date: June 2, 2005
    Inventors: Hisaji Oyake, Hiroaki Takahata, Kenji Yoneyama, Yuuichi Kawaguchi