Abstract: A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.

Abstract: A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.

Abstract: According to one embodiment, a substrate unit of the present invention comprises a first substrate, a second substrate and a coupling member. The first substrate has a first substrate main body and a circuit component. The second substrate has a second substrate main body, an opening portion provided at the second substrate main body, and a cooling module which cools the circuit component. The circuit component is mounted on a face of the first substrate main body which is opposite to the second substrate. The cooling module has a main body and a projecting portion. The coupling member fixes the main body to a second face of the second substrate main body, and couples the first substrate and the second substrate so as to fit the projecting portion in the opening portion and press the projecting portion against the circuit component.

Abstract: According to one embodiment, there is provided a printed wiring board includes a mounting surface for mounting an electronic component, a first component mounted on the mounting surface, an index portion provided on the mounting surface for defining a mounting position Pa of a second component being mounted on the mounting surface in a process after the first component is mounted, the index portion including two direction positions on the mounting surface, and the second component mounted on the mounting surface based on the index portion.

Abstract: According to one embodiment, a substrate unit of the present invention comprises a first substrate, a second substrate and a coupling member. The first substrate has a first substrate main body and a circuit component. The second substrate has a second substrate main body, an opening portion provided at the second substrate main body, and a cooling module which cools the circuit component. The circuit component is mounted on a face of the first substrate main body which is opposite to the second substrate. The cooling module has a main body and a projecting portion. The coupling member fixes the main body to a second face of the second substrate main body, and couples the first substrate and the second substrate so as to fit the projecting portion in the opening portion and press the projecting portion against the circuit component.

Abstract: To provide a circuit board comprising a plurality of first signal lines which transmits first signals, a plurality of second signal lines which transmits second signals which are higher in speed than the first signals, a joint which is bonded to a joint of another circuit board through an anisotropic conductive material, a plurality of first electrodes which are arranged at regular intervals separated by a first distance in the joint, each of the first electrodes are connected to a respective one of the first signal lines, and a plurality of second electrodes which are arranged at regular intervals separated by a second distance larger than the first distance in the joint, each of the second electrodes are connected to a respective one of the second signal lines.

Abstract: To provide a circuit board comprising a plurality of first signal lines which transmits first signals, a plurality of second signal lines which transmits second signals which are higher in speed than the first signals, a joint which is bonded to a joint of another circuit board through an anisotropic conductive material, a plurality of first electrodes which are arranged at regular intervals separated by a first distance in the joint, each of the first electrodes are connected to a respective one of the first signal lines, and a plurality of second electrodes which are arranged at regular intervals separated by a second distance larger than the first distance in the joint, each of the second electrodes are connected to a respective one of the second signal lines.

Abstract: A print board comprises a ground layer, an insulation layer, a signal layer formed on the insulation layer, formed in a predetermined line pattern, and serving as a transmission line for transmitting high-speed signals, and a pad formed on the signal layer. The signal layer has a line width that satisfies a characteristic impedance required for the transmission line, and the width of the signal layer is set substantially equal to the width of the pad.

Abstract: A print board comprises a ground layer, an insulation layer, a signal layer formed on the insulation layer, formed in a predetermined line pattern, and serving as a transmission line for transmitting high-speed signals, and a pad formed on the signal layer. The signal layer has a line width that satisfies a characteristic impedance required for the transmission line, and the width of the signal layer is set substantially equal to the width of the pad.