Abstract: A triplate line inter-layer connector and a planar array antenna are provided. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line, a first patch pattern formed at a connection-side terminal end of a first feeder line, a first feed substrate having a first shield spacer disposed therebeneath, and a second shield spacer disposed thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics. A second feeder line is provided on a second feed substrate together with a second patch pattern, and a second ground conductor has a first slit formed in a portion thereof located approximately intermediate between the first and second patch patterns.

Abstract: Provided is a triplate line inter-layer connector having excellent loss suppression capability and allowing for inter-layer connection at any position, and a planar array antenna having uniform frequency characteristics in a beam direction. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line. A first patch pattern is formed at a connection-side terminal end of a first feeder line. A first feed substrate has a first shield spacer disposed therebeneath, and a second shield spacer disposed just thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics in a respective one of the positions beneath and just above the first feed substrate.

Abstract: An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.