Patents by Inventor Yuuji Fujita

Yuuji Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200276896
    Abstract: The power device for a vehicle includes: a wheel bearing including a stationary ring and a rotary ring having a hub flange, the rotary ring being rotatably supported by the stationary ring via rolling element, the hub flange being configured to be attached with a wheel of a vehicle and a brake rotor; and a generator including a stator attached to the stationary ring of the wheel bearing and a rotor attached to the rotary ring of the wheel bearing, wherein the rotor includes a soft magnetic material part, magnets, and a resin material part that is integrally molded with the soft magnetic material part and the magnets.
    Type: Application
    Filed: April 16, 2020
    Publication date: September 3, 2020
    Applicant: NTN CORPORATION
    Inventors: Mitsuo KAWAMURA, Kentaro NISHIKAWA, Yuuji YADA, Yasuyuki FUJITA, Hiroki YABUTA
  • Publication number: 20200238817
    Abstract: The vehicle power device includes: a wheel bearing including a stationary ring and a rotary ring; and a motor including a stator and a rotor. The stator and the rotor of the motor generator have a smaller diameter than that of an outer peripheral part of the brake rotor, and an entirety of the motor, excluding a mounting part to the hub flange, is located within an axial range between the hub flange and an outboard-side surface of a chassis frame component. An insulating layer is interposed between the stationary ring and the stator.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 30, 2020
    Applicant: NTN CORPORATION
    Inventors: Hiroki YABUTA, Kentaro NISHIKAWA, Mitsuo KAWAMURA, Yasuyuki FUJITA, Yuuji YADA
  • Publication number: 20200198456
    Abstract: A wheel support bearing assembly includes a wheel support bearing and a power unit. The power unit is that of an outer rotor design in which a stator is located at an outer periphery of the wheel support bearing and a rotor is located radially outward of the stator. A radial extension of the entire power unit is sized to be radially inward of a peripheral section of a brake rotor. An entirety of the power unit, excluding a mount part thereof to a hub flange, is sized to be situated in an axial range between the hub flange and a mount surface, on an inboard side of the wheel support bearing. The rotor includes an outer shell magnetic body, which is made from soft magnetic material and forms an outer shell of the power unit, and permanent magnets that are provided to the outer shell magnetic body.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 25, 2020
    Applicant: NTN CORPORATION
    Inventors: Mitsuo KAWAMURA, Kentaro NISHIKAWA, Taisuke IGI, Yuuji YADA, Yasuyuki FUJITA, Hiroki Yabuta
  • Patent number: 9969146
    Abstract: Provided are a layered substrate that has excellent mechanical properties such as a flexural strength or a flexural modulus applicable to a structural material, the variations in those mechanical properties are small, exhibits excellent formability into a complicated shape, and is able to be molded in a short time, and a method for manufacturing the same. A layered substrate fabricated by layering plural sheets of sheet-shaped prepregs containing a reinforcing fiber oriented in one direction and a thermoplastic matrix resin, wherein the prepreg has a slit penetrating from the front surface to the back surface, each slit is provided so as to intersect with each reinforcing fiber only one time.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: May 15, 2018
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Takeshi Ishikawa, Masao Tomioka, Masahiro Osuka, Yuuji Fujita, Yukichi Konami, Takahiro Hayashi
  • Patent number: 9760085
    Abstract: According to one embodiment, a production support system includes: a production information storage unit; a manufacturing apparatus information storage unit; an inspection/measurement apparatus information storage unit; a planned lot number calculation unit; a first control mode calculation unit. The first control mode calculation unit is configured to calculate an appropriate control mode from the number of products to be subjected to the control of the final quality, a relationship between fluctuation of the final quality and a number of products when performing a predetermined feedback type/feedforward type combined APC, fluctuation of the final quality when performing a feedforward type APC, and fluctuation of the final quality when not performing the feedback type/feedforward type combined APC.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: September 12, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Muneyoshi Yamada, Akira Soga, Atsushi Itoh, Yuuji Fujita
  • Publication number: 20160016382
    Abstract: Provided are a layered substrate that has excellent mechanical properties such as a flexural strength or a flexural modulus applicable to a structural material, the variations in those mechanical properties are small, exhibits excellent formability into a complicated shape, and is able to be molded in a short time, and a method for manufacturing the same. A layered substrate fabricated by layering plural sheets of sheet-shaped prepregs containing a reinforcing fiber oriented in one direction and a thermoplastic matrix resin, wherein the prepreg has a slit penetrating from the front surface to the back surface, each slit is provided so as to intersect with each reinforcing fiber only one time.
    Type: Application
    Filed: March 10, 2014
    Publication date: January 21, 2016
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Takeshi ISHIKAWA, Masao TOMIOKA, Masahiro OSUKA, Yuuji FUJITA, Yokichi KONAMI, Takahiro HAYASHI
  • Publication number: 20150081241
    Abstract: According to one embodiment, a production support system includes: a production information storage unit; a manufacturing apparatus information storage unit; an inspection/measurement apparatus information storage unit; a planned lot number calculation unit; a first control mode calculation unit. The first control mode calculation unit is configured to calculate an appropriate control mode from the number of products to be subjected to the control of the final quality, a relationship between fluctuation of the final quality and a number of products when performing a predetermined feedback type/feedforward type combined APC, fluctuation of the final quality when performing a feedforward type APC, and fluctuation of the final quality when not performing the feedback type/feedforward type combined APC.
    Type: Application
    Filed: March 11, 2014
    Publication date: March 19, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Muneyoshi YAMADA, Akira SOGA, Atsushi ITOH, Yuuji FUJITA
  • Publication number: 20070116075
    Abstract: A laser diode driver includes a DC current source supplying DC current to a laser diode, a high frequency current source connected in parallel with the DC current source and supplying high frequency current to the laser diode. The laser diode driver further includes a circuit capable of changing the current of the DC current source when the high frequency current source is operating.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 24, 2007
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Yuuji Fujita, Makoto Sakaguchi
  • Patent number: 6825280
    Abstract: Disclosed are a propylene polymer composition possessing excellent balance among rigidity and low warpage, resistance to deterioration caused by thermal oxidation during processing, weathering resistance, antistatic properties, and low bleeding properties, and a propylene resin composition which can easily produce molded products having excellent balance between rigidity and impact resistance (particularly low-temperature impact resistance) or heat resistance. The propylene polymer composition and the propylene resin composition comprise a propylene block copolymer consisting essentially of the following blocks (a) and (b) and having a melt flow rate of 0.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: November 30, 2004
    Assignee: Japan Polychem Corporation
    Inventors: Yu Hayakawa, Tsuyoshi Ogasawara, Yuuji Fujita, Masao Sakaizawa, Kimiho Kosegaki, Toshihiko Sugano, Takao Tayano, Toru Suzuki, Yasuo Maruyama, Osamu Shibata, Takao Usami
  • Patent number: 6781783
    Abstract: Provided is a magnetic disc apparatus comprising a magnetic head for writing and reading data to and from a magnetic disc, a slider for floating up the magnetic head from the magnetic disc on rotation, a suspension having an IC chip mounting surface, for supporting the slider, a positioning mechanism for positioning a magnetic head at a predetermined position, and an IC chip mounted on the IC chip supporting surface of the suspension, wherein the rate of variation in temperature difference between opposite sides of the IC chip mounting position as a center on the IC chip mounting surface is set to be below about 3.5 K/sec. Thereby it is possible to restrain the averaged seek time for the magnetic disc from becoming longer.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: August 24, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Amano, Shigeo Nakamura, Osamu Narisawa, Mikio Tokuyama, Masahito Kobayashi, Hiroyasu Sasaki, Yuuji Fujita
  • Publication number: 20020080515
    Abstract: Provided is a magnetic disc apparatus comprising a magnetic head for writing and reading data to and from a magnetic disc, a slider for floating up the magnetic head from the magnetic disc on rotation, a suspension having an IC chip mounting surface, for supporting the slider, a positioning mechanism for positioning a magnetic head at a predetermined position, and an IC chip mounted on the IC chip supporting surface of the suspension, wherein the rate of variation in temperature difference between opposite sides of the IC chip mounting position as a center on the IC chip mounting surface is set to be below abut 3.5 K/sec. Thereby it is possible to restrain the averaged seek time for the magnetic disc from becoming longer.
    Type: Application
    Filed: December 18, 2001
    Publication date: June 27, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Yasuo Amano, Shigeo Nakamura, Osamu Narisawa, Mikio Tokuyama, Masahito Kobayashi, Hiroyashu Sasaki, Yuuji Fujita
  • Patent number: 5870289
    Abstract: A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive film. A direct through-hole connection is formed directly below a connecting pad so as to pass through the adhesive film and the wiring substrate. This direct through-hole connection directly connects the connecting pad to the wire. As a result of reduced area and thickness of the chip, the chip is mounted in high density, and high-density inputs and outputs are implemented by means of minute two-dimensional connections. Short wire connections directly connected to the chip permit high speed signal transmission, and high reliability is ensured by the dispersion of stress. Low-cost packaging can be effected by simple processes and facilities.
    Type: Grant
    Filed: December 14, 1995
    Date of Patent: February 9, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Masahide Tokuda, Takeshi Kato, Hiroyuki Itoh, Masayoshi Yagyu, Yuuji Fujita, Mitsuo Usami
  • Patent number: 5485039
    Abstract: A semiconductor device includes a semiconductor substrate having a pair of opposed main surfaces with a wiring conductor provided on one of the main surfaces; the substrate having at least one through hole extending therethrough so as to be perpendicular to the main surfaces; at least one electrically conductive pin provided on the other of the main surfaces at a position of the at least one through hole, and an adhesive filled into the at least one through hole for fixing the at least one conductive pin to the substrate, wherein the at least one conductive pin is connected electrically through the corresponding at least one through hole to the wiring conductor to transmit/receive an electrical signal to/from an external circuit.
    Type: Grant
    Filed: December 14, 1992
    Date of Patent: January 16, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Yuuji Fujita, Kenichi Mizuishi
  • Patent number: 5394490
    Abstract: A clock signal supply system is disclosed for a semiconductor device with a semiconductor chip and a wiring substrate connected in flip-chip fashion and an optical waveguide interposed in the space between electrode members, in which the mutual arrangement of the electrical interconnection and the optical waveguide interconnection on the wiring substrate is not affected and can be used separately from each other for different applications, thereby improving the throughput of the interconnections as a whole.
    Type: Grant
    Filed: August 11, 1993
    Date of Patent: February 28, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Kato, Yuuji Fujita, Kenichi Mizuishi, Atumi Kawata, Hiroyuki Itoh
  • Patent number: 5251100
    Abstract: A semiconductor integrated circuit device is equipped with a cooling system which serves to cool a plurality of integrated circuit chips mounted on a circuit board. The cooling system is kept in contact with the upper surfaces of the plurality of integrated circuit chips. A chip surface arranging plate of uniform thickness is formed with apertures smaller than the integrated circuit chips mounted on the circuit board. The cooling system is fixed on the chip surface arranging plate. The upper surfaces of the integrated circuit chips are substantially kept flush by the chip surface arranging plate. Further, the integrated circuit chips are thermally joined to the cooling system so that heat generated by the integrated circuit chips is removed by the cooling system. The plurality of integrated circuit chips are joined to the chip surface arranging plate by applying a vacuum that causes suction of air through the apertures formed in the chip surface arranging plate.
    Type: Grant
    Filed: August 25, 1992
    Date of Patent: October 5, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Yuuji Fujita, Masahide Tokuda
  • Patent number: 5021504
    Abstract: A thermoplastic resin composition having well-balanced properties which comprises 95-5 weight % of polycarbonate, 5-95 weight % of polyolefin and a particular combination of additional components selected from a styrene-ethylene.propylene copolymer, a styrene-ethylene. butyrene-styrene block copolymer, an AES resin, a styrene-olefin block copolymer, an unsaturated carboxylic acid-modified polyolefin, polybutylene terephthalate, a styrene-maleic anhydride copolymer, an oxazoline ring-containing styrene copolymer a saponified olefin-vinyl ester copolymer and an epoxy group-containing styrene copolymer.
    Type: Grant
    Filed: September 19, 1988
    Date of Patent: June 4, 1991
    Assignees: Tonen Sekiyukagaku Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuuji Fujita, Tadashi Sezume, Kitsusho Kitano, Kiyotada Narukawa, Takashi Mikami, Tetsuya Kawamura, Shigeru Sato, Takeyoshi Nishio, Toshio Yokoi, Takao Nomura