Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Abstract: An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device includes an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device, wherein a side surface of the upper surface side wall part a side end part of the electronic component accommodating device is formed in a taper shape and has an inclination angle from a horizontal surface, the inclination angle being equal to or less than 60 degrees.

Abstract: A heat exchanger includes a plurality of unit modules aligned in parallel, in which each unit module has a heat exchange function.

Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Abstract: A communication device which efficiently dissipates locally generated heat, and at the same time is small in size and light in weight, is provided. A high-efficiency heat-dissipating fin section having fins disposed on an heat pipe which is bent into an S shape is mounted on a high-temperature heat-generating section that generates high-temperature heat. A heat-dissipating fin section having fins disposed on a heat-receiving plate thereof is mounted on a low-temperature heat-generating section that generates heat having a lower temperature than that of the high-temperature heat generated by the high-temperature heat-generating section. This makes it possible to efficiently dissipate heat and reduce the size and weight of the communication device.

Abstract: There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.

Abstract: A transmitting and amplifying unit for a wireless communication device. The transmitting and amplifying unit includes a C-shaped frame having an upper plate having a first cutout, a lower plate having a second cutout aligned with the first cutout, and a side plate connecting the upper plate and the lower plate; a main amplifier unit fixed to the lower plate and having a concentrated heating portion; and a subamplifier unit fixed to the upper plate. The transmitting and amplifying unit further includes a radiating fin unit mounted on the concentrated heating portion of the main amplifier unit and extending upward through the first cutout of the lower plate and the second cutout of the upper plate. The radiating fin unit has an upper end fixed to the subamplifier unit.

Abstract: A heat exchanger includes a plurality of unit modules aligned in parallel, in which each unit module has a heat exchange function.

Abstract: A communication device which efficiently dissipates locally generated heat, and at the same time is small in size and light in weight, is provided. A high-efficiency heat-dissipating fin section having fins disposed on an heat pipe which is bent into an S shape is mounted on a high-temperature heat-generating section that generates high-temperature heat. A heat-dissipating fin section having fins disposed on a heat-receiving plate thereof is mounted on a low-temperature heat-generating section that generates heat having a lower temperature than that of the high-temperature heat generated by the high-temperature heat-generating section. This makes it possible to efficiently dissipate heat and reduce the size and weight of the communication device.

Abstract: There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.

Abstract: A transmitting and amplifying unit for a wireless communication device. The transmitting and amplifying unit includes a C-shaped frame having an upper plate having a first cutout, a lower plate having a second cutout aligned with the first cutout, and a side plate connecting the upper plate and the lower plate; a main amplifier unit fixed to the lower plate and having a concentrated heating portion; and a subamplifier unit fixed to the upper plate. The transmitting and amplifying unit further includes a radiating fin unit mounted on the concentrated heating portion of the main amplifier unit and extending upward through the first cutout of the lower plate and the second cutout of the upper plate. The radiating fin unit has an upper end fixed to the subamplifier unit.

Abstract: Disclosed is an electrophotographic process which comprises developing an electrophotographic light-sensitive layer having an electrostatic charge image of a certain polarity with a one-component type magnetic developer where positive and negative frictional charge polarities are mingled, under development bias voltage conditions capable of developing the electrostatic charge image, the background or both, and bringing the light-sensitive layer having a developer layer formed thereon into contact with a transfer sheet under a transfer charge of the same polarity as that of the electrostatic charge image when a positive image is formed or under a transfer charge of a polarity reverse to that of the electrostatic charge image when a negative image is formed, to form an image on the transfer sheet.

Abstract: The toner concentration of a two-component type developer including a mixture of a magnetic carrier and an electroscopic toner is adjusted by bringing a magnetic brush of the two-component type developer into sliding contact with a mesh screen to move the electroscopic toner toward the magnetic brush side or the opposite side through apertures of the mesh screen. Apparatus for adjusting the toner concentration in a two-component type developer includes a mechanism for forming a magnetic brush from a mixture of a magnetic carrier and an electroscopic toner and for delivering the magnetic brush. The mechanism includes a support formed of an electroconductive non-magnetic material and a magnet having a plurality of poles and being built in the interior of the support. At least one of the support and magnet is movable.

Abstract: A variable magnification copying apparatus includes first erasing element for removing electrical charge from the photosensitive member at an area outside the area of image of the original and second erasing element for removing electrical charge from the outside area, in cooperation with said first erasing element when the magnification is less than a predetermined value.