Abstract: Disclosed is a method of washing substrates, comprising the steps of (a) introducing a washing solution into a processing vessel having a wafer boat movably mounted therein to fill the vessel with the washing solution, (b) allowing a plurality of wafers to be held collectively by chuck such that the wafers held by the chuck are arranged at substantially an equal pitch, (c) dipping the wafers together with the chuck in the washing solution within the processing vessel, (d) transferring the wafers from the chuck onto the wafer boat in an upper region of the processing vessel, (e) moving the wafers together with the wafer boat within the washing solution to allow the substrates to be positioned in a lower region of the processing vessel, (f) discharging the washing solution from the upper region of the processing vessel, (g) supplying a fresh washing solution into the lower region of the processing vessel so as to cause the washing solution within the processing vessel to overflow the processing vessel, (h) taki

Abstract: Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Abstract: A substrate washing and drying apparatus comprising a processing section for holding wafers, to which process solution to wash and vapor for drying the wafers are introduced, a supply/discharge port for introducing solution to the process section, and discharging the solution from the process section, a solution supply mechanism for selecting one from a plurality of kinds of solution, a drying vapor generation section having a heater for generation vapor for drying, a discharging solution mechanism having an opening for rapidly discharging the solution from the processing section, resistivity detecting means for detecting a resistivity value of the process solution, and a controller for controlling the supply of solution to the process section based on the resistivity value detected by the resistivity detecting means.

Abstract: A washing method for washing objects includes the steps of supplying a washing liquid to a washing vessel and immersing objects in the washing liquid contained in the washing vessel. The method also includes the steps of discharging the liquid at least once from the washing vessel, and starting to apply the washing liquid to the objects when the objects are partly exposed to air as the liquid is discharged from the washing vessel. The washing liquid application is continued during exposure of the objects to the air to prevent the surface of the objects from being dried and stained.

Abstract: Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Abstract: A processing apparatus comprising a reaction chamber, a workpiece-supporting section located in the reaction chamber for supporting a workpiece, a gas distributor located in the reaction chamber and facing the workpiece-supporting section for distributing reaction gas to a workpiece that is on the supporting surface of the workpiece-supporting section, a gas supply for supplying the reaction gas into the reaction chamber through the gas distributor and at a predetermined pressure, and a drive mechanism for moving the gas distributor back and forth relative to the workpiece-supporting section in a direction that is parallel to the supporting surface of the workpiece-supporting section. The speed of the relative movement can be varied and the reaction gas flow rate can be controlled in accordance with the speed the relative movement or the position of the gas distributor with respect to the workpiece-supporting sector during the relative movement.

Abstract: An apparatus for drying substrates such as wafers while contacting IPA vapor with them to remove that solution, which adheres to them when they are washed, includes a vessel in which IPA is stored, a unit for supplying the IPA into the vessel, a unit for draining the IPA from the vessel, heater block arranged contactable with the underside of the vessel to heat the IPA in the vessel by heat conduction, a boat elevator for positioning the substrates in a steam existing space in which steam generated from the heated process solution and a water cooling system arranged in the vessel to exchanged heat between the IPA and cooling water so as to cool the IPA, which is to be drained from the vessel, by the cooling water.

Abstract: A wafer drying apparatus incorporated in a semiconductor wafer cleaning system includes a bath for storing IPA. A heater for generating an IPA vapor is arranged on the bath. The bath is surrounded by a housing. The housing has opening portions at three positions. The opening portions are opened/closed by shutters. A sensor for detecting a fire and a nozzle for discharging CO.sub.2 gas into the bath are arranged around the bath. A plurality of wafers are held by a chuck of a convey robot and are conveyed from the outside of the housing into the housing via the opening portions. When a fire is detected by the sensor, the chuck immediately retreats from the housing, and the shutters are closed. Signals for closing the shutters are transmitted to shutter drive sources again 10 seconds after the fire is detected, and discharging of CO.sub.2 gas is started 20 seconds after the fire is detected.

Abstract: A substrate drying apparatus comprising a vessel in which IPA is contained, a chamber enclosing the vessel, a heating heater for heating IPA into vapor in the vessel and in that region in the vessel where a plurality of substrates are vapor-processed, a mechanism for carrying the plural water-washed substrates into the vapor-processing region in the vessel, a mechanism located above the vapor-processing region in the vessel to cool the IPA vapor into solution drops, region in the chamber located above the cooling mechanism where the substrates can be dried while removing IPA from the substrates, and gas supply and exhaust devices for causing gas to flow from above to below in the drying region in the chamber.

Abstract: A substrates-cleaning apparatus comprising process vessels in which washing solutions are contained, a chuck mechanism having a first substrate holder section for carrying silicon wafers to the process vessels while holding them in it, and a boat mechanism having a second substrate holder section for receiving the wafers from the chuck mechanism and for supporting the wafers in the washing solutions, wherein said second substrate holder section comprises base members made of erosion and heat resistant material, and receiver members attached to the base members, having a plurality of substrate holding grooves thereon, and made of erosion and heat resistant synthetic resin substantially same in softness as or softer than the wafers.

Abstract: A washing system comprising a wafer washing section having plural chemical washing vessels, plural water washing vessels and a drier, a cassette washing section having a water washing device and a drier, a loader section for taking out the wafers from the cassettes and loading the wafers into the wafer washing section, an unloader section for returning the washed wafers in the washed cassette and unloading the wafers from the wafer washing section, a wafer transfer device the wafers in the wafer washing section, a cassette lifter for carrying the cassettes from the loader section to the cassette washing section, and a wire drive unit for carrying the cassettes in the cassette washing section.

Abstract: A rotary transfer arm for transferring semiconductor wafers is disposed in a closed housing. A closable opening portion is formed in the housing, through which the transfer arm can extend out from the housing. A fork is disposed at the distal end of the transfer arm. A plurality of holding grooves are formed in the fork to set a plurality of wafers with predetermined intervals between them. A cleaner for the fork is disposed in the upper portion of the housing. The cleaner has cleaning and drying nozzles mounted at the distal end of a switch arm. The switch arm can pivot between an operation position and a standby position. The switch arm can also move the cleaning and drying nozzles along the fork. During cleaning and drying, pure water is sprayed from the cleaning nozzles against the fork, and a drying gas is sprayed from the drying nozzles against it.