Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: To improve strength of an imaging module with an adjusted optical axis. An imaging device includes an imaging module and a holding unit. The imaging module provided in the imaging device includes an imaging element that images incident light introduced from an upper surface of a housing. The holding unit provided in the imaging device surrounds and holds a side surface of the imaging module, the side surface being adjacent to the upper surface of the housing. The holding unit surrounds and holds the side surface of the imaging module, thereby protecting the imaging module.

Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: Provided is a module including an organic substrate, an image sensor mounted on an upper surface of the organic substrate, a wire connecting the image sensor and the organic substrate, and a wire sealing unit adhered to a side surface of the image sensor while encompassing the wire. A thermal conductivity of the wire sealing unit is higher than a thermal conductivity of the organic substrate.

Abstract: To reduce deformation of an imaging device and to prevent a reduction in image quality. The imaging device includes an imaging element, a substrate, and a connection portion. The substrate included in the imaging device is formed of an organic substrate and an inorganic substrate, the organic substrate including an insulation layer that is made of an organic material, the inorganic substrate including an insulation layer that is made of an inorganic material. The imaging element included in the imaging device is bonded to the substrate. The connection portion included in the imaging device connects the substrate included in the imaging device and the imaging element included in the imaging device.

Abstract: The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.

Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: To improve strength of an imaging module with an adjusted optical axis. An imaging device includes an imaging module and a holding unit. The imaging module provided in the imaging device includes an imaging element that images incident light introduced from an upper surface of a housing. The holding unit provided in the imaging device surrounds and holds a side surface of the imaging module, the side surface being adjacent to the upper surface of the housing. The holding unit surrounds and holds the side surface of the imaging module, thereby protecting the imaging module.

Abstract: A manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. The imaging apparatus includes a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF).

Abstract: [Object] To suppress the heat rising of a module in which an image sensor is installed and fixed on a substrate more than before, make the time until the temperature of the module reaches a prescribed temperature later than before, and thereby make the available time of the module longer than before. [Solution] Provided is a module including: an organic substrate; an image sensor mounted on an upper surface of the organic substrate; a wire connecting the image sensor and the organic substrate; and a wire sealing unit adhered to a side surface of the image sensor while encompassing the wire. A thermal conductivity of the wire sealing unit is higher than a thermal conductivity of the organic substrate.

Abstract: The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.

Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: The present technology relates to an imaging apparatus and a manufacturing method of the imaging apparatus. A glass plate 13 is mounted at a position corresponding to an opening portion 15 a on a substrate 15. An imaging device 16 is mounted at a position with an optically appropriate distance in terms of design based on a surface of the glass plate 13 on a face of the substrate 15 opposite to a face on which the glass plate 13 is mounted, at a position corresponding to the opening portion 15 a. A lens barrel portion 11 is placed so that the optical system block 12 is set at a position with an optically appropriate distance on the glass plate 13, and fixed with an adhesive 14.

Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: The present technology relates to a semiconductor apparatus, a solid state imaging device, an imaging apparatus and electronic equipment which realize a smaller and thinner size and which enable improvement of optical characteristics, and a manufacturing method thereof. A side electrode 16c is formed on a side face of a substrate on which an imaging device 16 is formed. By this side electrode 16c being connected to an electrode pad 15b on the substrate 15 through a chip wiring 17 formed with solder, the imaging device 16 is electrically connected to the substrate 15. By this means, because it is possible to electrically connect the imaging device 16 to the substrate 15 without using wire bonding, space required for wire bonding is not required, so that it is possible to realize a smaller and thinner apparatus. The present technology can be applied to an imaging apparatus.

Abstract: The present technology relates to an imaging apparatus and a manufacturing method of the imaging apparatus, and electronic equipment and a manufacturing method of the electronic equipment which make it possible to obtain high optical characteristics. In step S1, a glass plate 13 is mounted at a position corresponding to an opening portion 15a on a substrate 15. In step S2, an imaging device 16 is mounted at a position with an optically appropriate distance in terms of design based on a surface of the glass plate 13 (or a predetermined reference plane) on a face of the substrate 15 opposite to a face on which the glass plate 13 is mounted, at a position corresponding to the opening portion 15a. In step S3, a lens barrel portion 11 is placed so that the optical system block 12 is set at a position with an optically appropriate distance in terms of design based on the surface of the glass plate 13 (or the predetermined reference plane) on the glass plate 13, and fixed with an adhesive 14.

Abstract: The present technology relates to a semiconductor apparatus, a solid state imaging device, an imaging apparatus and electronic equipment which realize a smaller and thinner size and which enable improvement of optical characteristics, and a manufacturing method thereof. A side electrode 16c is formed on a side face of a substrate on which an imaging device 16 is formed. By this side electrode 16c being connected to an electrode pad 15b on the substrate 15 through a chip wiring 17 formed with solder, the imaging device 16 is electrically connected to the substrate 15. By this means, because it is possible to electrically connect the imaging device 16 to the substrate 15 without using wire bonding, space required for wire bonding is not required, so that it is possible to realize a smaller and thinner apparatus. The present technology can be applied to an imaging apparatus.

Abstract: The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is as imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an intra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Abstract: A solid-state imaging unit includes: a solid-state imaging device mounted on a substrate; a bonding wire which electrically connects a pad formed on the solid-state imaging device and a lead formed on the substrate; a frame member having a frame shape which surrounds side portions of the solid-state imaging device; and an optical member having optical transparency and mounted on the frame member so as to face an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion which protrudes from an optical member side toward the imaging surface of the solid-state imaging device, and the frame member and the solid-state imaging device are integrally fixed to each other in a state where the leg portion comes into contact with an intermediate area which is located between an imaging area and a pad forming area on the imaging surface.