Patents by Inventor Yuuji MINAMIBORI
Yuuji MINAMIBORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240047794Abstract: Provided is a packaging material for a power storage device excellent in workability and piercing resistance. The present invention relates to a packaging material for a power storage device, including a base material layer 51, a barrier layer 52 laminated on an inner side of the base material layer 51, and a sealant layer 53 laminated an inner side of the barrier layer 52. The base material layer 51 is formed of a polyamide film and is 2.0% to 5.0% both in hot water shrinkage in a transverse direction (TD) and a machine direction (MD), 1.5% or less in a difference between the hot water shrinkage in the TD and the MD, 1.5 GPa to 3 GPa in elastic modulus in both the TD and the MD, and 320 MPa or more in at least one of breaking strengths in the TD and the MD.Type: ApplicationFiled: December 13, 2021Publication date: February 8, 2024Applicant: Resonac Packaging CorporationInventors: Daisuke NAKAJIMA, Yuuji MINAMIBORI
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Publication number: 20230420773Abstract: Provided is a battery packaging material in which the seal strength gradually decreases as the temperature rises, resulting in a gradual unsealing. The battery packaging material is composed of a substrate layer 13 served as an outer layer, a sealant layer 20A served as an inner layer, and a barrier layer 11 arranged between these two layers. The sealant layer 20A is composed of one or more layers. A first sealant layer 21 served as the innermost layer is made of a resin blend containing a polyolefin resin A having a melting point of 120° C. or above and a polyolefin resin B having a melting point of less than 120° C.Type: ApplicationFiled: June 22, 2023Publication date: December 28, 2023Applicant: Resonac Packaging CorporationInventors: Yuuji MINAMIBORI, Makoto KARATSU
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Patent number: 10239287Abstract: A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging.Type: GrantFiled: January 11, 2013Date of Patent: March 26, 2019Assignees: SHOWA DENKO PACKAGING CO., LTD., TOAGOSEI CO., LTD.Inventors: Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori
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Patent number: 9623629Abstract: Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat-resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). In the heat-resistant resin of the outside substrate layer (2), a biaxially oriented polyethyleneterephthalate film is used that, when the tensile breaking strength in the M direction is MB and the tensile breaking strength in the T direction is TB, the following are satisfied: 500 MPa=MB+TB=700 MPa; and??formula (I) |MB?TB|=30 MPa.Type: GrantFiled: March 29, 2012Date of Patent: April 18, 2017Assignee: Showa Denko Packaging Co., Ltd.Inventors: Tetsunobu Kuramoto, Yuuji Minamibori
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Patent number: 9553283Abstract: Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). A matte coat layer (6) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (2), and the gloss value of the surface thereof is suppressed to no greater than 30%.Type: GrantFiled: September 26, 2016Date of Patent: January 24, 2017Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Tetsunobu Kuramoto, Yuuji Minamibori
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Publication number: 20170012250Abstract: Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). A matte coat layer (6) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (2), and the gloss value of the surface thereof is suppressed to no greater than 30%.Type: ApplicationFiled: September 26, 2016Publication date: January 12, 2017Inventors: Tetsunobu KURAMOTO, Yuuji MINAMIBORI
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Patent number: 9515299Abstract: Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). A matte coat layer (6) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (2), and the gloss value of the surface thereof is suppressed to no greater than 30%.Type: GrantFiled: March 29, 2012Date of Patent: December 6, 2016Assignee: SHOWA DENKO PACKAGING CO., LTD.Inventors: Tetsunobu Kuramoto, Yuuji Minamibori
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Patent number: 9498935Abstract: A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3, in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2. The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.Type: GrantFiled: March 4, 2014Date of Patent: November 22, 2016Assignee: SHOWA DENKO PACKAGING CO.Inventors: Yuuji Minamibori, Tetsunobu Kuramoto
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Patent number: 9029010Abstract: The molding packaging material 1 according to the present invention includes a heat resistant resin layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, a metal foil layer 4 arranged between the heat resistant resin layer and the thermoplastic resin layer, and a black ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin layer 2. The black ink layer 10 contains carbon black, diamine, polyol, and hardening agent. The black ink layer does not partially crack and detach even when the molding packaging material according to the present invention is used in a somewhat harsh environment such as a hot and humid environment and/or at the time of molding or sealing.Type: GrantFiled: March 15, 2013Date of Patent: May 12, 2015Assignee: Showa Denko Packaging Co., Ltd.Inventors: Yuuji Minamibori, Koji Minamitani, Tetsunobu Kuramoto
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Publication number: 20150004476Abstract: A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging.Type: ApplicationFiled: January 11, 2013Publication date: January 1, 2015Inventors: Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori
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Publication number: 20140255764Abstract: A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3, in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2. The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.Type: ApplicationFiled: March 4, 2014Publication date: September 11, 2014Inventors: Yuuji MINAMIBORI, Tetsunobu KURAMOTO
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Publication number: 20140134475Abstract: Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat-resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). In the heat-resistant resin of the outside substrate layer (2), a biaxially oriented polyethyleneterephthalate film is used that, when the tensile breaking strength in the M direction is MB and the tensile breaking strength in the T direction is TB, the following are satisfied: 500 MPa=MB+TB=700 MPa; and??formula (I) |MB?TB|=30 MPa.Type: ApplicationFiled: March 29, 2012Publication date: May 15, 2014Applicant: Showa Denko Packaging Co., Ltd.Inventors: Tetsunobu Kuramoto, Yuuji Minamibori
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Publication number: 20140087241Abstract: Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). A matte coat layer (6) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (2), and the gloss value of the surface thereof is suppressed to no greater than 30%.Type: ApplicationFiled: March 29, 2012Publication date: March 27, 2014Applicant: SHOWA DENKO PACKAGING CO., LTD.Inventors: Tetsunobu Kuramoto, Yuuji Minamibori
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Publication number: 20130244088Abstract: The molding packaging material 1 according to the present invention includes a heat resistant resin layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, a metal foil layer 4 arranged between the heat resistant resin layer and the thermoplastic resin layer, and a black ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin layer 2. The black ink layer 10 contains carbon black, diamine, polyol, and hardening agent. The black ink layer does not partially crack and detach even when the molding packaging material according to the present invention is used in a somewhat harsh environment such as a hot and humid environment and/or at the time of molding or sealing.Type: ApplicationFiled: March 15, 2013Publication date: September 19, 2013Applicant: SHOWA DENKO PACKAGING CO., LTD.Inventors: Yuuji MINAMIBORI, Koji MINAMITANI, Tetsunobu KURAMOTO