Patents by Inventor Yuuji Ookawa

Yuuji Ookawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheet for dicing glass substrate and method of dicing glass substrate
    Patent number: 7041190
    Abstract: An adhesive sheet for dicing glass substrate comprising a base film and an adhesive layer arranged on the base film, wherein the base film has a thickness of 130 ?m or more and a tensile modulus of 1 GPa or more, and the adhesive layer has a thickness of 9 ?m or less. The adhesive sheet can give cut pieces excellent in shape and hardly causes cut pieces to be chipped or to scatter chips.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: May 9, 2006
    Assignee: Nitto Denko Corporation
    Inventor: Yuuji Ookawa
  • Adhesive sheet for dicing glass substrate
    Publication number: 20060093811
    Abstract: An adhesive sheet for dicing glass substrate includes a base film and an adhesive layer arranged on the base film. The base film has a thickness of 130 ?m or more and a tensile modulus of 1 GPa or more, and the adhesive layer has a thickness of 9 ?m or less. The adhesive sheet can give cut pieces excellent in shape and hardly causes cut pieces to be chipped or to scatter chips.
    Type: Application
    Filed: December 16, 2005
    Publication date: May 4, 2006
    Inventor: Yuuji Ookawa
  • Adhesive sheet for dicing glass substrate and method of dicing glass substrate
    Publication number: 20040020338
    Abstract: An adhesive sheet for dicing glass substrate comprising a base film and an adhesive layer arranged on the base film, wherein the base film has a thickness of 130 &mgr;m or more and a tensile modulus of 1 GPa or more, and the adhesive layer has a thickness of 9 &mgr;m or less. The adhesive sheet can give cut pieces excellent in shape and hardly causes cut pieces to be chipped or to scatter chips.
    Type: Application
    Filed: June 2, 2003
    Publication date: February 5, 2004
    Inventor: Yuuji Ookawa