Patents by Inventor Yuuji Ootani

Yuuji Ootani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220223544
    Abstract: In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Inventors: Daisuke FUKUOKA, Tomomi OKUMURA, Yuuji OOTANI, Wataru KOBAYASHI, Takumi NOMURA, Tomoaki MITSUNAGA, Takahiro HIRANO, Takamichi SAKAI, Kengo OKA
  • Publication number: 20110180938
    Abstract: In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).
    Type: Application
    Filed: January 13, 2011
    Publication date: July 28, 2011
    Applicants: DENSO CORPORATION, Dow Corning Toray Co., Ltd.
    Inventors: Kazuya HIRASAWA, Yuuji Ootani, Akiyoshi Asai, Hirokazu Imai, Hiroyoshi Kunieda, Harumi Kodama, Masayuki Onishi, Ryo Sakaguchi, Kazumi Nakayoshi
  • Patent number: 5983171
    Abstract: An auto-index method enabling to select words used for heading of an index based on an indexing object extraction condition set by a user. In order to generate an index intended for electronic document files, words and phrases are extracted from document files that may become an object for creating an index, the positions of words and phrases on an electronic publication at the time of extracting are extracted, an indexing object extraction condition inputted by a user is received and extracted words and phrases and the indexing object extraction condition are compared with each other to thereby extract index objective words and phrases.
    Type: Grant
    Filed: January 2, 1997
    Date of Patent: November 9, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Yooichi Yokoyama, Miho Matsushita, Yuuji Ootani, Noriaki Yokoyama