Patents by Inventor Yuuji Ooyama

Yuuji Ooyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lithium Ion Capacitor and Layered Member for Lithium Ion Capacitor
    Publication number: 20120236466
    Abstract: A mass-producible lithium ion capacitor that allows lithium ions to be easily occluded by a negative electrode in advance is provided. A layered member includes: two copper foils each having a portion in which tabs are formed on one side along the longitudinal direction of the copper foils, and a portion in which a large number of through holes are formed and which is disposed adjacent to the portion with the tabs, and lithium metal having a thin plate shape and sandwiched between the copper foils to contact the portions with the through holes of the copper foils. The tabs are joined to a negative current collector ring, and electrically connected to a negative current collecting member. By leaving the layered member to stand for a predetermined period, it is possible to cause lithium ions to be occluded by a negative active material of the lithium ion capacitor.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 20, 2012
    Applicant: Shin-Kobe Electric Machinery Co., Ltd.
    Inventors: Yukio IIDA, Toshinori Dozono, Hideaki Uehara, Goichi Tatsumi, Yuuji Ooyama, Haruki Hoshi, Masaaki Sekiya
  • Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
    Patent number: 7947332
    Abstract: A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: May 24, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Nozomu Takano, Kazumasa Takeuchi, Katsuyuki Masuda, Masashi Tanaka, Kazuhito Obata, Yuuji Ooyama, Yoshitsugu Matsuura
  • Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Printed Wiring Board, and, Method for Manufacturing Multi-Layer Printed Wiring Board
    Publication number: 20070277375
    Abstract: A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.
    Type: Application
    Filed: June 22, 2005
    Publication date: December 6, 2007
    Inventors: Nozomu Takano, Kazumasa Takeuchi, Katsuyuki Masuda, Masashi Tanaka, Kazuhito Obata, Yuuji Ooyama, Yoshitsugu Matsuura