Abstract: Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, wherein in the formula (a1), R1s are each independently a hydrogen atom or hydroxyl group, provided that at least one R1 is hydroxyl group; and R2 is a hydrogen atom or a C1-4 alkyl group; and in the formula (a2), R3s are each independently a group having a cationic polymerizable group, or a hydrogen atom, provided that at least one R3 is a group having a cationic polymerizable group; and R4 is a hydrogen atom or a C1-4 alkyl group.

Abstract: A chemical mechanical polishing aqueous dispersion includes (A) a sulfonic acid group-containing water-soluble polymer, (B) an amino acid, (C) abrasive grains, and (D) an oxidizing agent.

Abstract: An automatic collimation surveying apparatus is provided with a collimation camera optical system (47) of a high magnification ratio; a wide-angle CCD camera optical system (89) having a wide field of view; a touch-panel display (64) for displaying an image picked up by both CCD camera optical systems; an image processing unit (60) for discriminating points of measurement from the above-described image; a touch-pen for pointing out points of measurement on the above-described image; and an automatic collimation unit (69) for automatically collimating the pointed-out points of measurement. In addition, illumination light from light source (80) is concurrently used as collimation light and is aligned so as to be emitted along the collimation axis (O) of a collimation camera optical system. The surveying apparatus can be remotely controlled from a measurement controller such as a peripheral personal computer.

Abstract: A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 ?m, a 10-point height (Rz) of 40 to 150 ?m, a core roughness depth (Rk) of 12 to 50 ?m and a reduced peak height (Rpk) of 7 to 40 ?m, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.

Abstract: An automatic collimation surveying apparatus is provided with a collimation camera optical system (47) of a high magnification ratio; a wide-angle CCD camera optical system (89) having a wide field of view; a touch-panel display (64) for displaying an image picked up by both CCD camera optical systems; an image processing unit (60) for discriminating points of measurement from the above-described image; a touch-pen for pointing out points of measurement on the above-described image; and an automatic collimation unit (69) for automatically collimating the pointed-out points of measurement. In addition, illumination light from light source (80) is concurrently used as collimation light and is aligned so as to be emitted along the collimation axis (O) of a collimation camera optical system. The surveying apparatus can be remotely controlled from a measurement controller such as a peripheral personal computer.