Patents by Inventor Yuuji Wakisawa

Yuuji Wakisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module with an improved heat sink/insulation plate arrangement
    Patent number: 5585672
    Abstract: A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.
    Type: Grant
    Filed: May 18, 1995
    Date of Patent: December 17, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiko Koike, Ryuichi Saito, Sigeki Sekine, Yuuji Wakisawa
  • Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
    Patent number: 5446318
    Abstract: A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: August 29, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiko Koike, Ryuichi Saito, Sigeki Sekine, Yuuji Wakisawa