Abstract: There is provided an imaging device including an imaging element that acquires a captured image of a subject, a light emission unit that emits light to the subject, and a control unit that is capable of controlling a timing of exposure performed by the imaging element and a timing of light emission performed by the light emission unit. In a mode in which imaging is performed with a plurality of times of consecutive light emission by the light emission unit, the control unit controls at least one of a timing of the exposure and a timing of the light emission so that light amounts effective for exposure in each imaging are substantially the same.

Abstract: A control device includes: a detection section configured to detect setting to a predetermined imaging mode; and a control section configured to set a predetermined method of zooming in response to the setting to the imaging mode, and to perform zoom control with a subject distance fixed.

Abstract: There is provided an imaging device including an imaging element that acquires a captured image of a subject, a light emission unit that emits light to the subject, and a control unit that is capable of controlling a timing of exposure performed by the imaging element and a timing of light emission performed by the light emission unit. In a mode in which imaging is performed with a plurality of times of consecutive light emission by the light emission unit, the control unit controls at least one of a timing of the exposure and a timing of the light emission so that light amounts effective for exposure in each imaging are substantially the same.

Abstract: A semiconductor device which can make the generation of gate parasitic oscillations more difficult than a semiconductor device of the related art is provided.

Abstract: Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.

Abstract: The invention has as an object to provide a reliable, failure-free tool holding apparatus which allows digitization of a tool holding apparatus having a tool moving function, is free from various problems encountered upon digitization, and does not cause an erroneous operation upon scattering and attachment of chips or cutting oil. In order to achieve this object, a scale member and a moving amount detecting means are arranged to oppose each other. The scale member is arranged at the side of a slide movable in a predetermined direction, and is moved following the movement of the slide. The moving amount detecting means is arranged at the side of the main body and supplies a predetermined number of oscillation pulses to a display in accordance with the moving amount of the scale member. The scale member is enclosed with stretchable members such as bellows members, and is moved in the enclosed, sealed space.