Patents by Inventor Yuuji Yoshitomi
Yuuji Yoshitomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7137483Abstract: An elevator in which the sheave diameter is reduced and the attendant lowering of the rope life and strength is suppressed to secure safety and reliability. To this end, a rope is used in which a plurality of element wires constituting the wire rope are each covered with resin material and the whole wire rope is covered with resin material, thereby reducing the wear due to slippage between the element wires and the wear due to contact with the sheave, which wear occurs when the rope is entrained around the sheave. When the elevator sheave diameter is reduced, a worried lowering of the rope life can be suppressed or the rope life can be improved. Thus, it is possible to achieve reduction of size and weight of equipment including motors and hoists, installation space saving for elevators, improved safety and reliability of the system by virtue of the increased rope life.Type: GrantFiled: January 22, 2001Date of Patent: November 21, 2006Assignee: Hitachi, Ltd.Inventors: Kensuke Kato, Takashi Teramoto, Hiromi Inaba, Hiroshi Nagase, Ichiro Nakamura, Yuuji Yoshitomi
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Publication number: 20050180108Abstract: An electronic apparatus includes a case mounting a semiconductor element therein, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the case, and a liquid driver which drives a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein and having at least a predetermined volume of the coolant to delimit a coolant surface within the tank. The tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.Type: ApplicationFiled: April 19, 2005Publication date: August 18, 2005Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
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Patent number: 6885556Abstract: An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.Type: GrantFiled: June 24, 2004Date of Patent: April 26, 2005Assignee: Hitachi, Ltd.Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
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Publication number: 20050078450Abstract: A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver which forms a circulation flow passage through which a cooling liquid flows. At least one of the water-cooling jacket, the heat-radiation pipe, the tank and the liquid driver is attached on a plate, and the water-cooling device is detachable with respect to the heat-generating element by the plate.Type: ApplicationFiled: October 20, 2004Publication date: April 14, 2005Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou, Tsuyoshi Nakagawa
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Publication number: 20050007730Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is achieved through circulation of a liquid, in particular, for providing the structure of being high in cooling performance and reliability, wherein a heat-radiation pipe 9 is connected to a heat-radiation plate 10 disposed in a rear surface of a display 2, while thermally connecting a water-cooling jacket 8 with the heat-generating element 7, thereby circulating a coolant liquid between the water-cooling jacket 8 and the heat-radiation pipe 9 by means of a liquid driving device 11. The water-cooling jacket 8 can be formed in one body of a jacket base and a flow passage therein through the die-cast forming thereof, or can be constructed in one body with the water-cooling jacket and the flow passage of piping, through connection between the jacket base and the metal pipe.Type: ApplicationFiled: July 10, 2002Publication date: January 13, 2005Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Yasuhiko Sasaki, Tsuyoshi Nakagawa
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Publication number: 20040228092Abstract: An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.Type: ApplicationFiled: June 24, 2004Publication date: November 18, 2004Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
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Patent number: 6809927Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.Type: GrantFiled: May 9, 2003Date of Patent: October 26, 2004Assignee: Hitachi, Ltd.Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou, Tsuyoshi Nakagawa
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Patent number: 6757169Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.Type: GrantFiled: May 6, 2003Date of Patent: June 29, 2004Assignee: Hitachi, Ltd.Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
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Publication number: 20040008475Abstract: In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.Type: ApplicationFiled: May 9, 2003Publication date: January 15, 2004Inventors: Shigeo Ohashi, Yoshihiro Kondo, Rintaro Minamitani, Takashi Naganawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou, Tsuyoshi Nakagawa
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Publication number: 20040008489Abstract: An electronic equipment or apparatus, small-sized and thinned in the thickness thereof, having a system for cooling an semiconductor element generating high temperature, comprising: a case mounting the semiconductor element within an inside thereof; a heat-receiving member being thermally connected with the semiconductor element; a heat-radiation member being disposed on an interior surface side of the case; a liquid driving means for driving a liquid coolant between the heat-radiation member and the heat-receiving member; a tank for accumulating the liquid coolant therein; and tubes for connecting between the tank, the heat-radiation member, and the heat-receiving member, wherein the tube is made of either one of butyl rubber, nitrobutadien rubber, fluororubber, ethylene-propylene rubber, hydrinrubber, or polysulfide rubber, so that a permeation amount “q” of the coolant is determined to be equal to or less than a containing amount “Q” of the coolant.Type: ApplicationFiled: May 8, 2003Publication date: January 15, 2004Inventors: Rintaro Minamitani, Takashi Naganawa, Makoto Kitano, Yuuji Yoshitomi, Yoshihiro Kondo, Shigeo Ohashi, Hajime Katou, Masato Nakanishi, Tsuyoshi Nakagawa
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Publication number: 20030161100Abstract: In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.Type: ApplicationFiled: May 6, 2003Publication date: August 28, 2003Inventors: Yoshihiro Kondo, Shinji Matsushita, Shigeo Ohashi, Takashi Naganawa, Rintaro Minamitani, Tsuyoshi Nakagawa, Yuuji Yoshitomi, Masato Nakanishi, Hajime Katou
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Publication number: 20030089551Abstract: An elevator in which the sheave diameter is reduced and the attendant lowering of the rope life and strength is suppressed to secure safety and reliability. To this end, a rope is used in which a plurality of element wires constituting the wire rope are each covered with resin material and the whole wire rope is covered with resin material, thereby reducing the wear due to slippage between the element wires and the wear due to contact with the sheave, which wear occurs when the rope is entrained around the sheave. When the elevator sheave diameter is reduced, a worried lowering of the rope life can be suppressed or the rope life can be improved. Thus, it is possible to achieve reduction of size and weight of equipment including motors and hoists, installation space saving for elevators, improved safety and reliability of the system by virtue of the increased rope life.Type: ApplicationFiled: April 18, 2002Publication date: May 15, 2003Inventors: Kensuke Kato, Takashi Teramoto, Hiromi Inaba, Hiroshi Nagase, Ichiro Nakamura, Yuuji Yoshitomi
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Patent number: 5307687Abstract: An electromagnetic flowmeter for measuring the flow rate of a fluid. The flowmeter has a measuring tube made of ceramics and defining a fluid passage therein for the fluid, electrodes having ends exposed to an interior of the measuring tube through holes which are formed in a wall of the measuring tube, a magnetic field generating device disposed around the electrodes, and a case encasing the measuring tube, the electrodes and the magnetic field generating means. A ratio t/R between a wall thickness t and a mean radius R of the measuring tube is determined such that stress generated in the measuring tube by the fluid in the measuring tube does not exceed the rupture stress of the measuring tube. The measuring tube can have flanges on both axial ends thereof, a radial height of the flange from an outer surface of the measuring tube is not greater than the wall thickness of the tube when the tube is made of Al.sub.2 O.sub.Type: GrantFiled: May 29, 1992Date of Patent: May 3, 1994Assignee: Hitachi, Ltd.Inventors: Masatsugu Arai, Akiomi Kohno, Kazuaki Yokoi, Yuuji Yoshitomi, Yutaka Sakurai, Tamio Ishihara
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Patent number: 4730474Abstract: A method of relieving residual stress in a metal pipe comprises the steps of applying, by using a pressure medium, a low pressure to an interior of the metal pipe placed in dies, and applying, while preventing the buckling, an axial compression load to the pipe so as to effect a uniform plastic deformation of the entire metal pipe while maintaining the desired shape of the pipe, thereby relieving the residual stress in the metal pipe.Type: GrantFiled: March 31, 1986Date of Patent: March 15, 1988Assignee: Hitachi, Ltd.Inventors: Shota Iwakura, Yuuji Yoshitomi, Takashi Naganawa, Toshio Saitoh, Tatsuo Seki