Patents by Inventor Yuujiro Kaneko

Yuujiro Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module and method for manufacturing semiconductor module
    Patent number: 8952525
    Abstract: A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: February 10, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Takeshi Tokuyama, Nobutake Tsuyuno, Kinya Nakatsu, Tokihito Suwa, Yuujiro Kaneko
  • Semiconductor Module and Method for Manufacturing Semiconductor Module
    Publication number: 20140197532
    Abstract: A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.
    Type: Application
    Filed: March 4, 2011
    Publication date: July 17, 2014
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Takeshi Tokuyama, Nobutake Tsuyuno, Kinya Nakatsu, Tokihito Suwa, Yuujiro Kaneko