Patents by Inventor Yuuki INAGAKI
Yuuki INAGAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11846651Abstract: An electrostatic actuator includes a fixed electrode and a movable electrode arranged to face the fixed electrode. The movable electrode is configured to be displaceable with respect to the fixed electrode and a fixed portion. An attractive force acts between the movable electrode and the fixed portion. In the electrostatic actuator, a non-linear vibration of the movable electrode when a voltage is applied to the fixed electrode and the movable electrode is reduced by the attractive force acting between the movable electrode and the fixed portion.Type: GrantFiled: October 28, 2020Date of Patent: December 19, 2023Assignee: DENSO CORPORATIONInventors: Shota Harada, Keitaro Ito, Tomoya Jomori, Hideo Yamada, Yuuki Inagaki, Teruhisa Akashi, Yoshiyuki Hata
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Publication number: 20230324175Abstract: A mounting structure includes a micro vibrator and a mounting substrate. The micro vibrator includes a curved surface portion having an annular curved surface and a connecting portion extending from the curved surface portion toward an inner center position of the curved surface portion. The micro vibrator is disposed so that the connecting portion is bonded to the mounting substrate and the curved surface portion is in a hollow state free from other elements. The mounting substrate includes a plurality of electrode portions that are arranged to face and surround a rim of the curved surface portion of the micro vibrator, and spaced apart from each other, the rim being an end of the curved surface portion opposite to the connecting portion. Further, the mounting substrate includes a guard electrode.Type: ApplicationFiled: March 24, 2023Publication date: October 12, 2023Inventors: Hideaki NISHIKAWA, Yusuke KAWAI, Takahiko YOSHIDA, Yuuki INAGAKI, Shota HARADA, Keitaro ITO, Katsuaki GOTO
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Publication number: 20230294210Abstract: A method of manufacturing a micro-oscillator includes: preparing a substrate having a flat portion and a curved surface portion formed in a three-dimensional curved shape protruding from one surface of the flat portion, the curved surface portion being surrounded by the flat portion; and irradiating an outer surface of the curved surface portion with a laser beam to separate the curved surface portion from the flat portion.Type: ApplicationFiled: March 14, 2023Publication date: September 21, 2023Inventors: YUUKI INAGAKI, YUJI ITO, YUKI ICHIHASHI
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Publication number: 20230288203Abstract: In a mounting structure, a micro vibrator has: a curved surface portion having a hemispherical curved surface; a connecting portion extending from the curved surface portion toward a center of a hemispherical shape of the curved surface portion; and a surface electrode covering at least a part of the connecting portion and at least a part of the curved surface portion. A mounting substrate has two or more wirings and a part of the micro vibrator is connected to the mounting substrate. The wirings each have an electrode connection portion connected to a portion of the surface electrode covering the connecting portion at an end. The two or more wirings include a voltage application wiring and a voltage detection wiring. The voltage application wiring is spaced away from the voltage detection wiring on the mounting substrate.Type: ApplicationFiled: February 15, 2023Publication date: September 14, 2023Inventors: SHOTA HARADA, KEITARO ITO, HIDEAKI NISHIKAWA, YUUKI INAGAKI, KATSUAKI GOTO, TAKAHIKO YOSHIDA, YUSUKE KAWAI
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Patent number: 11740087Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.Type: GrantFiled: March 24, 2022Date of Patent: August 29, 2023Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, MIRISE Technologies CorporationInventors: Shota Harada, Keitaro Ito, Katsuaki Goto, Yuuki Inagaki, Takahiko Yoshida, Yusuke Kawai, Teruhisa Akashi, Hirofumi Funabashi
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Publication number: 20230264411Abstract: A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.Type: ApplicationFiled: February 3, 2023Publication date: August 24, 2023Applicant: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHOInventors: Norio FUJITSUKA, Keiichi SHIMAOKA, Teruhisa AKASHI, Shota HARADA, Yuuki INAGAKI, Katsuaki GOTO, Keitaro ITO, Takahiko YOSHIDA
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Patent number: 11733044Abstract: An inertial sensor includes a lower substrate and an upper substrate. The upper substrate includes a micro oscillator, electrodes and a pad, which are independent of each other. The micro oscillator includes a curved surface portion, a joint portion recessed inward from an apex of the curved surface portion and joined to a support portion of the lower substrate, a rim at an end of the curved surface portion and a conductive film covering the micro oscillator. The curved surface portion is in an aerial state. The rim is made of the same material as the electrodes, located on a virtual flat plane formed by the electrodes, and apart from and surrounded by the electrodes. A portion of the conductive film that covers the joint portion is electrically bonded to a lower metal film covering the support portion.Type: GrantFiled: April 27, 2022Date of Patent: August 22, 2023Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, MIRISE Technologies CorporationInventors: Yuuki Inagaki, Yusuke Kawai, Takahiko Yoshida, Shota Harada, Katsuaki Goto, Keitaro Ito
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Publication number: 20230061042Abstract: In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and / or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.Type: ApplicationFiled: August 9, 2022Publication date: March 2, 2023Inventors: Katsuaki GOTO, Shota HARADA, Keitaro ITO, Yuuki INAGAKI, Takahiko YOSHIDA, Yusuke KAWAI
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Publication number: 20220373332Abstract: An inertial sensor includes a lower substrate and an upper substrate. The upper substrate includes a micro oscillator, electrodes and a pad, which are independent of each other. The micro oscillator includes a curved surface portion, a joint portion recessed inward from an apex of the curved surface portion and joined to a support portion of the lower substrate, a rim at an end of the curved surface portion and a conductive film covering the micro oscillator. The curved surface portion is in an aerial state. The rim is made of the same material as the electrodes, located on a virtual flat plane formed by the electrodes, and apart from and surrounded by the electrodes. A portion of the conductive film that covers the joint portion is electrically bonded to a lower metal film covering the support portion.Type: ApplicationFiled: April 27, 2022Publication date: November 24, 2022Inventors: YUUKI INAGAKI, YUSUKE KAWAI, TAKAHIKO YOSHIDA, SHOTA HARADA, KATSUAKI GOTO, KEITARO ITO
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Publication number: 20220315411Abstract: A micro vibration body includes a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion. A mounting substrate includes an inner frame portion and electrode portions, which surround an inner frame portion. A joining member is provided in an inner region of the mounting substrate surrounded by the inner frame portion. The recessed portion of the micro vibration body has a bottom surface defining a mounted surface located in the inner region and joined to the mounting substrate via the joining member. The curved surface portion has a rim that includes an end portion of the curved surface portion on an opposite side to the recessed portion. The rim has a rim lower surface located on a same plane as the mounted surface or a tip end portion of the mounted surface.Type: ApplicationFiled: March 24, 2022Publication date: October 6, 2022Inventors: Keitaro ITO, Shota HARADA, Katsuaki GOTO, Yuuki INAGAKI, Teruhisa AKASHI, Hirofumi FUNABASHI, Takahiko YOSHIDA, Yusuke KAWAI
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Publication number: 20220316880Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.Type: ApplicationFiled: March 24, 2022Publication date: October 6, 2022Inventors: Shota HARADA, Keitaro ITO, Katsuaki GOTO, Yuuki INAGAKI, Takahiko YOSHIDA, Yusuke KAWAI, Teruhisa AKASHI, Hirofumi FUNABASHI
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Publication number: 20220187072Abstract: A support structure for a micro-vibrator includes: a micro-vibrating body having a curved surface portion and a recess recessed from the curved surface portion; and a support member having a rod and an adhesive member arranged at a tip end of the rod. The support member is adhered on a connecting surface of the recess through the adhesive member. The connecting surface of the recess is an internal bottom surface of the recess.Type: ApplicationFiled: November 2, 2021Publication date: June 16, 2022Inventors: TERUHISA AKASHI, HIROFUMI FUNABASHI, YUUKI INAGAKI
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Publication number: 20210041475Abstract: An electrostatic actuator includes a fixed electrode and a movable electrode arranged to face the fixed electrode. The movable electrode is configured to be displaceable with respect to the fixed electrode and a fixed portion. An attractive force acts between the movable electrode and the fixed portion. In the electrostatic actuator, a non-linear vibration of the movable electrode when a voltage is applied to the fixed electrode and the movable electrode is reduced by the attractive force acting between the movable electrode and the fixed portion.Type: ApplicationFiled: October 28, 2020Publication date: February 11, 2021Inventors: Shota HARADA, Keitaro ITO, Tomoya JOMORI, Hideo YAMADA, Yuuki INAGAKI, Teruhisa AKASHI, Yoshiyuki HATA
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Patent number: 10395975Abstract: A semiconductor device has a semiconductor substrate where a plurality of elements or penetration electrodes are arranged and a trench is arranged to insulate and separate the plurality of elements or penetrating elements by surrounding the plurality of elements or penetration electrodes. The trench is arranged to penetrate both sides of the semiconductor substrate, and has an inner part where a space is arranged. Accordingly, it is possible to configure a semiconductor device having a structure to suppress insulation breakdown while simplifying a manufacturing process and improving yield of product manufacture.Type: GrantFiled: March 11, 2015Date of Patent: August 27, 2019Assignee: DENSO CORPORATIONInventors: Yuuki Inagaki, Kazushi Asami, Yasuhiro Kitamura
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Publication number: 20150270339Abstract: A semiconductor device has a semiconductor substrate where a plurality of elements or penetration electrodes are arranged and a trench is arranged to insulate and separate the plurality of elements or penetrating elements by surrounding the plurality of elements or penetration electrodes. The trench is arranged to penetrate both sides of the semiconductor substrate, and has an inner part where a space is arranged. Accordingly, it is possible to configure a semiconductor device having a structure to suppress insulation breakdown while simplifying a manufacturing process and improving yield of product manufacture.Type: ApplicationFiled: March 11, 2015Publication date: September 24, 2015Inventors: Yuuki INAGAKI, Kazushi ASAMI, Yasuhiro KITAMURA