Abstract: A heat circuit may include a controller configured to execute a first process and then a defrosting operation. The first process may be a process to execute a first air-heating operation and a heat storage operation simultaneously. The second process may be a process to execute a defrosting operation. The controller may be configured, in the first air-heating operation, to cause the radiator to heat a radiator passage and cause the air-heating apparatus to heat air using heat of a air-heating passage while circulating the heat medium in the radiator passage and the air-heating passage. The controller may be configured, in the heat storage operation, to circulate the heat medium in an electrical apparatus passage and a bypass passage. The controller may be configured, in the defrosting operation, to circulate the heat medium in the electrical apparatus passage and the radiator passage.

Abstract: A heat management device may include: a first heat circuit; a second heat circuit; a heat exchanger configured to cool the first heat circuit and heat the second heat circuit; air-heating apparatus configured to heat air using the second heat circuit; a battery and electrical apparatus configured to be cooled by the first heat circuit; and a radiator configured to exchange heat between the first heat circuit and outside air. A controller may be configured, in the second process, to cause the heat exchanger to cool the heat exchanger passage while a heat medium circulates in the heat exchanger passage and the battery passage and bypasses the radiator passage. The controller may be configured, in the third process, to cause the radiator to cool the heat medium while the heat medium circulates in the radiator passage and the electrical apparatus passage and bypasses the heat exchanger passage.

Abstract: A heat management device may include: a first heat circuit; a second heat circuit; a heat exchanger configured to cool the first heat circuit and heat the second heat circuit; air-heating apparatus configured to heat air using the second heat circuit; a battery and electrical apparatus configured to be cooled by the first heat circuit; and a radiator configured to exchange heat between the first heat circuit and outside air. A controller may be configured, in the second process, to cause the heat exchanger to cool the heat exchanger passage while a heat medium circulates in the heat exchanger passage and the battery passage and bypasses the radiator passage. The controller may be configured, in the third process, to cause the radiator to cool the heat medium while the heat medium circulates in the radiator passage and the electrical apparatus passage and bypasses the heat exchanger passage.

Abstract: A heat circuit may include a controller configured to execute a first process and then a defrosting operation. The first process may be a process to execute a first air-heating operation and a heat storage operation simultaneously. The second process may be a process to execute a defrosting operation. The controller may be configured, in the first air-heating operation, to cause the radiator to heat a radiator passage and cause the air-heating apparatus to heat air using heat of a air-heating passage while circulating the heat medium in the radiator passage and the air-heating passage. The controller may be configured, in the heat storage operation, to circulate the heat medium in an electrical apparatus passage and a bypass passage. The controller may be configured, in the defrosting operation, to circulate the heat medium in the electrical apparatus passage and the radiator passage.

Abstract: A positive type photosensitive resin composition for forming patterned resin film is provided. The patterned resin film has high transparency, low dielectric constant, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, and excellent adhesive properties with the substrate, which is obtained by developing with an alkali solution. The positive type photosensitive resin composition contains copolymer of compound of formula (I) and 1,2-quinonediazido compound, or further mixes with other alkali-soluble polymers, in formula (I), R1 is hydrogen or alkyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine; and R2, R3 and R4 are independently hydroxyl group, alkyl group having 1-5 carbon atoms, alkoxyl group having 1-5 carbon atoms or —O(Si(ClH2l+1)2O)mSi(CpH2p+1)3, 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5.

Abstract: A material of cured film, a thermosetting film and a display device are provided. The thermosetting composition includes a solvent and at least one siloxane polymer selected from the group consisting of siloxane polymer (A) obtained by hydrolyzing or condensing a silane mixture containing a monofunctional silane represented by formula (1) and a trifunctional silane represented by formula (2), and siloxane polymer (B) obtained by hydrolyzing or condensing a silane mixture containing a bifunctional silane represented by formula (3) and a tetrafunctional silane represented by formula (4). R independently represents hydrogen, an alkyl group having 1 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen, an aryl group having 6 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen, or an alkenyl group having 2 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen. R? independently represents a hydrolyzable group.

Abstract: A material of cured film, a thermosetting film and a display device are provided. The thermosetting composition includes a solvent and at least one siloxane polymer selected from the group consisting of siloxane polymer (A) obtained by hydrolyzing or condensing a silane mixture containing a mono functional silane represented by formula (1) and a trifunctional silane represented by formula (2), and siloxane polymer (B) obtained by hydrolyzing or condensing a silane mixture containing a bifunctional silane represented by formula (3) and a tetrafunctional silane represented by formula (4). R independently represents hydrogen, an alkyl group having 1 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen, an aryl group having 6 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen, or an alkenyl group having 2 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen. R? independently represents a hydrolyzable group.

Abstract: A material of cured film, a thermosetting film and a display device are provided. The thermosetting composition includes a solvent and at least one siloxane polymer selected from the group consisting of siloxane polymer (A) obtained by hydrolyzing or condensing a silane mixture containing a monofunctional silane represented by formula (1) and a trifunctional silane represented by formula (2), and siloxane polymer (B) obtained by hydrolyzing or condensing a silane mixture containing a bifunctional silane represented by formula (3) and a tetrafunctional silane represented by formula (4). R independently represents hydrogen, an alkyl group having 1 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen, an aryl group having 6 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen, or an alkenyl group having 2 to 10 carbons whose arbitrary hydrogen can be replaced by a halogen. R? independently represents a hydrolyzable group.

Abstract: A positive photosensitive polymer composition of the invention contains: a copolymer obtained by the radical polymerization of monomers including a radical polymerizable monomer (a1) having a (meth)acryloyl group and a polyalkylene glycol group a terminal of which is an alkoxy group; and a 1,2-quinone diazide compound. The positive photosensitive polymer composition may further contain a copolymer obtained by the radical polymerization of monomers not including the monomer (a1).

Abstract: A positive type photosensitive resin composition for forming patterned resin film is provided. The patterned resin film has high transparency, low dielectric constant, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, and excellent adhesive properties with the substrate, which is obtained by developing with an alkali solution. The positive type photosensitive resin composition contains copolymer of compound of formula (I) and 1,2-quinonediazido compound, or further mixes with other alkali-soluble polymers, in formula (I), R1 is hydrogen or allyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine; and R2, R3 and R4 are independently hydroxyl group, alkyl group having 1-5 carbon atoms, alkoxyl group having 1-5 carbon atoms or —O(Si(ClH2l+1)2O)m Si(CpH2p+1)3, 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5.