Patents by Inventor Yuuki KINPARA
Yuuki KINPARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230321968Abstract: A method for repairing an electrostatic chuck device that is formed by bonding an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal with a first adhesive layer sandwiched therebetween is provided. The method includes a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive.Type: ApplicationFiled: August 30, 2021Publication date: October 12, 2023Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Keisuke MAEDA, Yuuki KINPARA
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Patent number: 11471987Abstract: An electrostatic chuck device comprising a mounting table having a mounting surface, a focus ring; and a cooling element, wherein the mounting table has a holding portion surrounding the mounting surface, the holding portion has an annular groove portion having a through-hole, the holding portion has inner and outer peripheral surfaces which hold the focus ring and are located on both sides of the groove portion, the holding surface satisfies conditions (i) and (ii), (i) a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a second point corresponding to an outermost periphery of the holding surface has a positive or a negative inclination from the innermost periphery toward the outermost periphery, wherein a difference between a height of the first point and a height of the second point is 0 ?m to 10 ?m, and (ii) leak areas of the inner peripheral surface and the outer peripheral surface are less than 0.7 mm2.Type: GrantFiled: August 2, 2019Date of Patent: October 18, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Keisuke Maeda, Masaki Ozaki, Masayuki Shiojiri, Takeshi Watanabe, Shinichi Maeta, Yuuki Kinpara
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Patent number: 11348819Abstract: An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, an electrostatic attraction electrode; a base part configured to cool the electrostatic chuck part; a heater disposed in a layered manner between the electrostatic chuck part and the base part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the insulator located on the electrostatic chuck part side is separated from the electrostatic chuck part with a space interposed therebetween.Type: GrantFiled: December 11, 2018Date of Patent: May 31, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yuuki Kinpara, Ryuuji Hayahara, Kazunori Ishimura, Hitoshi Kouno
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Publication number: 20210308812Abstract: An electrostatic chuck device includes: a mounting table provided with a mounting surface; a focus ring; and a cooling element, in which a holding portion of the mounting table is provided with an annular groove portion surrounding the mounting table, a through-hole that is open on a bottom surface of the groove portion, upper surfaces on both sides of the groove portion in a width direction in the holding portion form a holding surface that comes into contact with the focus ring and holds the focus ring, the holding surface is composed of an inner peripheral surface located further on an inner periphery side than the groove portion and an outer peripheral surface located further on an outer periphery side than the groove portion, and the holding surface satisfies the following conditions (i) and (ii), wherein (i) the holding surface has a shape in which in a cross section in a thickness direction, a straight line connecting a first point corresponding to an innermost periphery of the holding surface and a seType: ApplicationFiled: August 2, 2019Publication date: October 7, 2021Inventors: Keisuke MAEDA, Masaki OZAKI, Masayuki SHIOJIRI, Takeshi WATANABE, Shinchi MAETA, Yuuki KINPARA
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Patent number: 11024528Abstract: An electrostatic chuck device comprising: a placing table having a placing surface on which a plate-shaped sample is placed, an electrostatic attraction electrode, which is located on a lower side of the placing table in such a manner that the electrode is located on a surface side opposite to the placing surface of the placing table, a base part on which at least the placing table and the electrostatic attraction electrode are mounted, a focus ring which surrounds the placing table wherein the focus ring is a continuous ring or is divided into two or more portions, and a lift pin which is movable in an up-down direction and raises the entirety of or at least a part of the focus ring from the base part.Type: GrantFiled: October 21, 2016Date of Patent: June 1, 2021Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yoshiaki Moriya, Keigo Maki, Hitoshi Kouno, Kazuto Ando, Yuuki Kinpara
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Patent number: 10923381Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.Type: GrantFiled: January 18, 2017Date of Patent: February 16, 2021Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Mamoru Kosakai, Yukio Miura, Kazunori Ishimura, Keisuke Maeda, Hitoshi Kouno, Yuuki Kinpara, Shinichi Maeta, Tomomi Ito
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Publication number: 20200343125Abstract: An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, and provided with an electrostatic attraction electrode; a base part which is disposed on a side opposite to the mounting surface with respect to the electrostatic chuck part and is configured to cool the electrostatic chuck part; a heater which is disposed in a layered manner between the electrostatic chuck part and the base part or in an interior of the electrostatic chuck part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the iType: ApplicationFiled: December 11, 2018Publication date: October 29, 2020Applicant: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yuuki KINPARA, Ryuuji HAYAHARA, Kazunori ISHIMURA, Hitoshi KOUNO
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Publication number: 20190019714Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.Type: ApplicationFiled: January 18, 2017Publication date: January 17, 2019Inventors: Mamoru KOSAKAI, Yukio MIURA, Kazunori ISHIMURA, Keisuke MAEDA, Hitoshi KOUNO, Yuuki KINPARA, Shinichi MAETA, Tomomi ITO
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Publication number: 20180308737Abstract: An electrostatic chuck device comprising: a placing table having a placing surface on which a plate-shaped sample is placed, an electrostatic attraction electrode, which is located on a lower side of the placing table in such a manner that the electrode is located on a surface side opposite to the mounting surface of the placing table, a base part on which at least the placing table and the electrostatic attraction electrode are mounted, a focus ring which surrounds the placing table wherein the focus ring is a continuous ring or is divided into two or more portions, and a lift pin which is movable in an up-down direction and raises the entirety of or at least a part of the focus ring from the base part.Type: ApplicationFiled: October 21, 2016Publication date: October 25, 2018Applicant: Sumitomo Osaka Cement Co., Ltd.Inventors: Yoshiaki MORIYA, Keigo MAKI, Hitoshi KOUNO, Kazuto ANDO, Yuuki KINPARA