Abstract: According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.

Abstract: According to one embodiment, a thermal print head includes a heat sink, a head substrate having a plurality of heat generating elements placed on the heat sink and disposed in a primary scanning direction, a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit, and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, wherein a plurality of first bonding wires is disposed in parallel in the primary scanning direction, and among the first bonding wires, the first bonding wire having a length of at least 2 mm or more is a metal wire having a Young's modulus greater than that of gold.

Abstract: According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.

Abstract: According to one embodiment, a thermal print head includes a heat sink, a head substrate having a plurality of heat generating elements placed on the heat sink and disposed in a primary scanning direction, a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit, and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, wherein a plurality of first bonding wires is disposed in parallel in the primary scanning direction, and among the first bonding wires, the first bonding wire having a length of at least 2 mm or more is a metal wire having a Young's modulus greater than that of gold.