Patents by Inventor Yuuki Okamoto

Yuuki Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240140918
    Abstract: A compound represented by formula (1) below, useful for treating cancer. In the formula, R1 and R3-R8 each independently represents a hydrogen atom or an alkyl group, R2 represents a hydrogen atom or a group represented by —ORa, R9 represents a group represented by —C(O)NRcRf, Ra, Re, and Rf each independently represents a hydrogen atom, an arylalkyl group that may have a substituent, or a heteroarylalkyl group.
    Type: Application
    Filed: January 28, 2022
    Publication date: May 2, 2024
    Inventors: Isamu SHIINA, Motoyuki SHIMONAKA, Takatsugu MURATA, Yuuki OBATA, Toshirou NISHIDA, Koji OKAMOTO
  • Publication number: 20230326254
    Abstract: An authentication apparatus (2000) acquires a target image (30) including a face area (32) of a target entity (20). The authentication apparatus (2000) computes, for one or more registered entities, an authentication score indicating a level of a probability that the target entity (20) matches the registered entity by using face information (50) of the registered entity and the face area (32). The authentication apparatus (2000) detects a symbol (42) from the target image (30) when there is no registered entity whose authentication score is greater than a first threshold. The symbol (42) is displayed on an attachment (40) worn on the face. When determining whether there is a registered entity matching the symbol (42) among the registered entities satisfying a predetermined condition based on the authentication score, the authentication apparatus (2000) determines that there is a registered entity that matches the target entity (20).
    Type: Application
    Filed: September 28, 2020
    Publication date: October 12, 2023
    Applicant: NEC Corporation
    Inventor: Yuuki OKAMOTO
  • Patent number: 11629988
    Abstract: A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 18, 2023
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Tsutomu Kono, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
  • Publication number: 20210108953
    Abstract: A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Tsutomu Kono, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
  • Patent number: 10921169
    Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: February 16, 2021
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu Kono, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
  • Publication number: 20200213663
    Abstract: A renderer device to be controlled by a controller device connected to a communication network, the renderer device including: a memory unit that stores network connection information used by the controller device to establish a connection; a detector that detects whether a monitor device is connected to the renderer device via the communication network; an information update unit that updates the network connection information stored in the memory unit into network connection information for monitor used to connect to the monitor device, when the detector has detected that the monitor device is connected via the communication network; and a communication unit that sends the network connection information stored in the memory unit to the controller device, when receiving a request from the controller device.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 2, 2020
    Inventor: Yuuki OKAMOTO
  • Publication number: 20180073905
    Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.
    Type: Application
    Filed: November 15, 2017
    Publication date: March 15, 2018
    Inventors: Tsutomu KONO, Yuuki OKAMOTO, Takeshi MORINO, Keiji HANZAWA
  • Patent number: 9846067
    Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: December 19, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu Kono, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
  • Publication number: 20150137282
    Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.
    Type: Application
    Filed: January 26, 2015
    Publication date: May 21, 2015
    Inventors: Tsutomu KONO, Yuuki OKAMOTO, Takeshi MORINO, Keiji HANZAWA
  • Patent number: 8969977
    Abstract: The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: March 3, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu Kono, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
  • Publication number: 20130152675
    Abstract: Provided is a thermal fluid flow rate measurement device that inhibits the thermal fluid flow rate measurement device and peripheral parts from thermally affecting an intake air temperature detection element and measures an intake air temperature with high accuracy. The thermal fluid flow rate measurement device includes an auxiliary passage 8 that is inserted into a main passage 2 to acquire a part of an air flow 7 in the main passage, a base member 5 that forms a part of the auxiliary passage, a flow rate detection element 11 that is supported by the base member and disposed in the auxiliary passage to detect the flow rate of a fluid, and a circuit section 10 that is electrically connected to the flow rate detection element and housed in a circuit chamber 21 formed by a mold member 4 which is a part of the auxiliary passage.
    Type: Application
    Filed: August 16, 2011
    Publication date: June 20, 2013
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masayuki Hio, Takeshi Morino, Yuuki Okamoto
  • Publication number: 20110140211
    Abstract: The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 16, 2011
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu KONO, Yuuki Okamoto, Takeshi Morino, Keiji Hanzawa
  • Patent number: 7916867
    Abstract: A content receiving apparatus, capable of resuming transmission of a content without assigning a new key even when transmission of the content is suspended, is provided. A content receiving apparatus is an apparatus which receives contents. The content receiving apparatus includes: a key exchange unit which exchanges, with a content transmitting apparatus for transmitting a content, a key which is to be used in encrypting a content and which is valid only for a prescribed period; a reception unit which receives the content encrypted by using the key; a detection unit which detects when a time during which the key is not used reaches a prescribed time; and a transmission unit which transmits, to the content transmitting apparatus, information for not making the key invalid, when it is detected that the time during which the key is not is used has reached the prescribed time.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: March 29, 2011
    Assignee: Panasonic Corporation
    Inventors: Takumi Tanabe, Yuuki Okamoto, Yasushi Ayaki
  • Publication number: 20080201755
    Abstract: The present invention provides a broadcast receiving system capable of receiving programs with a secondary viewing terminal device(s) even when a primary viewing terminal device is not turned on, and detecting a secondary viewing terminal device(s) used in an unauthorized manner. When device authentication between the secondary viewing terminal device and the primary viewing terminal device is established through a communication line, viewing is allowed for the secondary viewing terminal device. When the device authentication is not established, viewing is controlled for the secondary viewing terminal device based on viewing restriction information generated by the center device based on the power status of the primary viewing terminal device.
    Type: Application
    Filed: February 14, 2008
    Publication date: August 21, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventor: Yuuki Okamoto
  • Publication number: 20080201770
    Abstract: A communication control device with high confidentiality is provided, which allows content access only from devices in a specific group, and ensures that no content information is exposed to any devices for which content access is not allowed. A password selection portion selects a common password required for connecting to a network, or a secret password required for establishing a communication channel with a specific reception device. A transmission portion transmits contents or information associated therewith to the reception device via the network established by using the common password or the secret password.
    Type: Application
    Filed: February 19, 2008
    Publication date: August 21, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yuuki OKAMOTO, Kentaro Saito, Nobuhiko Arashin
  • Publication number: 20070140490
    Abstract: A content receiving apparatus, capable of resuming transmission of a content without assigning a new key even when transmission of the content is suspended, is provided. A content receiving apparatus is an apparatus which receives contents. The content receiving apparatus includes: a key exchange unit which exchanges, with a content transmitting apparatus for transmitting a content, a key which is to be used in encrypting a content and which is valid only for a prescribed period; a reception unit which receives the content encrypted by using the key; a detection unit which detects when a time during which the key is not used reaches a prescribed time; and a transmission unit which transmits, to the content transmitting apparatus, information for not making the key invalid, when it is detected that the time during which the key is not is used has reached the prescribed time.
    Type: Application
    Filed: December 18, 2006
    Publication date: June 21, 2007
    Inventors: Takumi Tanabe, Yuuki Okamoto, Yasushi Ayaki