Patents by Inventor Yuuki Okamura

Yuuki Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230047950
    Abstract: To provide an adhesive tape that is difficult to deform, can suppress stickiness on the sides, and can reduce the emission of greenhouse gases while meeting the required characteristics of adhesive tape, such as adhesive strength and holding force, the present invention use an adhesive tape including a base material, which is a laminate with a backside layer formed on one side of a base fabric by lamination processing; and an adhesive layer disposed on the opposite side of the base material from the backside layer, wherein the backside layer includes a thermoplastic resin including polyolefin and the adhesive layer includes natural rubber, a wood-based filler, a plant-derived plasticizer and a tackifier.
    Type: Application
    Filed: October 21, 2022
    Publication date: February 16, 2023
    Applicant: TERAOKA SEISAKUSHO CO., LTD.
    Inventors: Yuushi ASAI, Yuuki OKAMURA
  • Publication number: 20200360179
    Abstract: A means can be used instead of or with conventional temperature control to achieve warming device temperature control at a lower cost, prevent or reduce deterioration of a warming device over time, and lower generated heat temperature due to storage at high temperatures. The warming device can be used for the same. A higher level temperature control means can be used for warming devices for medical applications. An improved warming device can be used for medical applications with a high level of safety and efficacy. A temperature control agent controls a maximum temperature of a warming device with a heat generating composition that generates heat by reaction with oxygen. Said agent includes an aliphatic compound that has a particle form that will not pass through a standard sieve with a #60 mesh, a melting point of 35-65° C., and an aqueous solubility (g/100 mL) at 20° C. of ?5.
    Type: Application
    Filed: February 1, 2019
    Publication date: November 19, 2020
    Applicant: FERRIC INC.
    Inventors: Masayoshi Ikezawa, Yuuki Okamura, Hirokazu Miyashita, Eiji Miyashita