Patents by Inventor Yuuki Sanada
Yuuki Sanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9980407Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.Type: GrantFiled: September 17, 2015Date of Patent: May 22, 2018Assignee: DENSO CORPORATIONInventors: Takashi Yoshimizu, Yuuki Sanada
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Patent number: 9941182Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.Type: GrantFiled: June 3, 2014Date of Patent: April 10, 2018Assignee: DENSO CORPORATIONInventors: Norihisa Imaizumi, Yuuki Sanada, Masayuki Takenaka, Shinya Uchibori, Kengo Oka, Tasuke Fukuda, Keitarou Nakama
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Publication number: 20170290187Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.Type: ApplicationFiled: September 17, 2015Publication date: October 5, 2017Inventors: Takashi YOSHIMIZU, Yuuki SANADA
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Patent number: 9686854Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.Type: GrantFiled: September 24, 2013Date of Patent: June 20, 2017Assignee: DENSO CORPORATIONInventors: Yuuki Sanada, Norihisa Imaizumi, Shinya Uchibori, Masaji Imada, Toshihiro Nakamura, Eiji Yabuta, Masayuki Takenaka
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Publication number: 20160104653Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.Type: ApplicationFiled: June 3, 2014Publication date: April 14, 2016Inventors: Norihisa IMAIZUMI, Yuuki SANADA, Masayuki TAKENAKA, Shinya UCHIBORI, Kengo OKA, Tasuke FUKUDA, Keitarou NAKAMA
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Publication number: 20150319840Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.Type: ApplicationFiled: September 24, 2013Publication date: November 5, 2015Inventors: Yuuki SANADA, Norihisa IMAIZUMI, Shinya UCHIBORI, Masaji IMADA, Toshihiro NAKAMURA, Eiji YABUTA, Masayuki TAKENAKA
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Patent number: 8426747Abstract: In a printed wiring board, a first inner layer wiring line is formed on one surface of a wiring line formation layer, a resin film made of electric insulation resin is formed on an area other than the first inner layer wiring line formed on the wiring line formation layer. The resin film and the first inner layer wiring line have the same plane surface. A second wiring line is formed on the resin film, and the second wiring line is thinner in thickness than the first inner layer wiring line. A limit of error in thickness of the resin film and the first inner layer wiring line is within 10% of the thickness of each of the resin film and the first inner layer wiring line.Type: GrantFiled: October 7, 2010Date of Patent: April 23, 2013Assignee: DENSO CORPORATIONInventors: Shinya Uchibori, Nobumasa Handa, Yuuki Sanada
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Publication number: 20110094780Abstract: In a printed wiring board, a first inner layer wiring line is formed on one surface of a wiring line formation layer, a resin film made of electric insulation resin is formed on an area other than the first inner layer wiring line formed on the wiring line formation layer. The resin film and the first inner layer wiring line have the same plane surface. A second wiring line is formed on the resin film, and the second wiring line is thinner in thickness than the first inner layer wiring line. A limit of error in thickness of the resin film and the first inner layer wiring line is within 10% of the thickness of each of the resin film and the first inner layer wiring line.Type: ApplicationFiled: October 7, 2010Publication date: April 28, 2011Applicant: DENSO CORPORATIONInventors: Shinya Uchibori, Nobumasa Handa, Yuuki Sanada
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Patent number: 7612434Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.Type: GrantFiled: October 25, 2007Date of Patent: November 3, 2009Assignee: Denso CorporationInventors: Norihisa Imaizumi, Yuuki Sanada, Takeshi Ishikawa
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Publication number: 20080061410Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.Type: ApplicationFiled: October 25, 2007Publication date: March 13, 2008Applicant: DENSO CORPORATIONInventors: Norihisa Imaizumi, Yuuki Sanada, Takeshi Ishikawa
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Patent number: 7304370Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.Type: GrantFiled: January 13, 2005Date of Patent: December 4, 2007Assignee: DENSO CORPORATIONInventors: Norihisa Imaizumi, Yuuki Sanada, Takeshi Ishikawa
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Publication number: 20050151229Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.Type: ApplicationFiled: January 13, 2005Publication date: July 14, 2005Inventors: Norihisa Imaizumi, Yuuki Sanada, Takeshi Ishikawa