Abstract: A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.

Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm and first and second retaining members. In a peripheral edge portion of the first retaining member, of a region facing one face of the sensor diaphragm, a region on an outer peripheral side is a bonded region bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a non-bonded region not bonded to the one face of the sensor diaphragm. In the peripheral edge portion of the first retaining member, a ring-shaped groove is formed protruding in a direction of a wall thickness of the first retaining member, continuous with the non-bonded region of the peripheral edge portion. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.

Abstract: A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.