Abstract: The present invention provides a mobile robot that can simultaneously absorb an impact received from an uneven road surface while moving and estimate the position or orientation of the mobile robot while functioning. The mobile robot according to the present invention has an operation mechanism having a multi-jointed arm, and a movement mechanism that causes the operation mechanism to move, the mobile robot being characterized in that: the movement mechanism has a first support part and a second support part, which support the weight of the movement mechanism; and the second support part is installed at a position that is nearer to an outer peripheral section, in terms of the movement direction of the movement mechanism, than is the installation position of the first support part.

Abstract: The present invention relates to a semiconductor manufacturing apparatus, and an object of the invention is to prevent breakage and deformation of semiconductor substrates without deteriorating operability in processing. In order to achieve the object, a semiconductor manufacturing apparatus has a stage (100) on which a semiconductor substrate (30) is placed, and the stage (100) has a first metal portion (10) that is made of metal and that comes in contact with the semiconductor substrate (30) placed thereon, and an electroconductive elastic-body portion (20) that is made of an electroconductive elastic body and that comes in contact with the semiconductor substrate (30) placed thereon. A contaminant (40) is embedded in the electroconductive elastic-body portion (20).

Abstract: A semiconductor manufacturing apparatus, to prevent breakage and deformation of semiconductor substrates without deteriorating operability in processing. The semiconductor manufacturing apparatus includes a stage on which a semiconductor substrate is placed, and the stage includes a first metal portion made of metal and that comes in contact with the semiconductor substrate placed thereon, and an electroconductive elastic-body portion made of an electroconductive elastic body and that comes in contact with the semiconductor substrate placed thereon. A contaminant is embedded in the electroconductive elastic-body portion.