Patents by Inventor Yuuko Ookuma

Yuuko Ookuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device capable of preventing disconnection in a through hole
    Patent number: 6414395
    Abstract: A through hole passes through an interlayer isolation film and an antireflection film, to partially expose a surface of a first wiring layer. A clearance filling member fills up a clearance under an inner edge of the antireflection film. A barrier metal film continuously covers the exposed surface of the first wiring layer, an inner wall surface of the through hole and a surface of the interlayer isolation film. Passing through the through hole, a second wiring layer is connected with the first wiring layer through the barrier metal film. Thus provided is a method of fabricating a semiconductor device improved to be capable of avoiding disconnection of a wire in a through hole.
    Type: Grant
    Filed: September 17, 1999
    Date of Patent: July 2, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yuuko Ookuma, Kimio Hagi