Patents by Inventor Yuusaku SHIMIZU

Yuusaku SHIMIZU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic bottle can and method for producing the same
    Patent number: 11827416
    Abstract: A metallic bottle can including a metallic base material of the bottle shape that has a mouth portion having a threaded portion, a shoulder portion, a body portion and a bottom portion, wherein, on the outer surface of said mouth portion, a finishing varnish layer is provided directly on said metallic base material, and said finishing varnish layer has an MEK extractability of 2 to 8% by mass.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: November 28, 2023
    Assignee: TOYO SEIKAN CO., LTD.
    Inventors: Yuusaku Shimizu, Yasuhiro Yukawa, Kouji Yamada
  • METALLIC BOTTLE CAN AND METHOD FOR PRODUCING THE SAME
    Publication number: 20200010242
    Abstract: A metallic bottle can including a metallic base material of the bottle shape that has a mouth portion having a threaded portion, a shoulder portion, a body portion and a bottom portion, wherein, on the outer surface of said mouth portion, a finishing varnish layer is provided directly on said metallic base material, and said finishing varnish layer has an MEK extractability of 2 to 8% by mass.
    Type: Application
    Filed: March 22, 2018
    Publication date: January 9, 2020
    Applicant: TOYO SEIKAN CO., LTD.
    Inventors: Yuusaku SHIMIZU, Yasuhiro YUKAWA, Kouji YAMADA
  • ENCAPSULATING SHEET AND ELECTRONIC DEVICE
    Publication number: 20120296010
    Abstract: An encapsulating sheet is obtained by subjecting a kneaded material to plastic working, the kneaded material including an epoxy resin represented by General Formula (1) below, a curing agent, and an inorganic filler, (where R1 to R4 are the same or different, and each represents a methyl group or a hydrogen atom; and X represents —CH2—, —O—, or —S—).
    Type: Application
    Filed: May 18, 2012
    Publication date: November 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuusaku SHIMIZU, Eiji TOYODA, Tomoo YAMAGUCHI, Yasunobu INA
  • RESIN KNEADED MATERIAL AND SHEET
    Publication number: 20120295997
    Abstract: A resin kneaded material has not more than 30 pores having a pore diameter of not less than 20 ?m in a surface area of 4.00 mm2.
    Type: Application
    Filed: May 18, 2012
    Publication date: November 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tsuyoshi TORINARI, Hirofumi ONO, Minoru YAMANE, Eiji TOYODA, Yuusaku SHIMIZU, Tsutomu NISHIOKA
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20090246918
    Abstract: The present invention provides a method of manufacturing a semiconductor device in which a semiconductor element is mounted on a wiring circuit board and a clearance between the wiring circuit board and the semiconductor element is sealed with a sealing material, the method including: a sealing material arranging step of arranging the sealing material on at least one of a terminal-provided surface of the semiconductor element and a terminal-provided surface of the wiring circuit board; a sealing step of pressing the semiconductor element to the wiring circuit board under such a condition that a terminal of the semiconductor element and a terminal of the wiring circuit board are opposed with each other via the sealing material at a reduced pressure of 13300 Pa (absolute pressure) or less, thereby combining the semiconductor element with the wiring circuit board; and subsequent to the sealing step, a terminal connecting step of heating and fusing at least one of the terminal of the semiconductor element and the
    Type: Application
    Filed: March 30, 2009
    Publication date: October 1, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroshi NORO, Yuusaku SHIMIZU, Katsumi SHIMADA, Daisuke TSUKAHARA