Patents by Inventor Yuusuke ADACHI
Yuusuke ADACHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250022631Abstract: A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.Type: ApplicationFiled: September 27, 2024Publication date: January 16, 2025Inventor: Yuusuke ADACHI
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Patent number: 12106869Abstract: A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.Type: GrantFiled: September 2, 2020Date of Patent: October 1, 2024Assignee: Suncall CorporationInventor: Yuusuke Adachi
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Patent number: 11931309Abstract: An actuator unit of the present invention includes upper and lower frames respectively connectable to a thigh frame and a lower leg frame, an actuator-side rotational connecting part connecting both frames in a rotatable manner around a pivot axis, a driver producing driving force for rotating the lower frame around the pivot axis, upper and lower connecting bodies respectively connecting the upper frame to the thigh frame and the lower frame to the lower leg frame, and an intermediate connecting body connecting the vicinity of the actuator-side rotational connecting part to the vicinity of a brace-side rotational connecting part, the intermediate connecting body having a ball stud and an accommodation depression respectively provided on one and the other of the knee-ankle-foot orthosis and the actuator unit.Type: GrantFiled: April 28, 2017Date of Patent: March 19, 2024Assignees: Suncall Corporation, Kyoto UniversityInventors: Yasushi Fujita, Yuusuke Adachi, Tadao Tsuboyama, Noriaki Ichihashi, Koji Ohata
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Publication number: 20230378736Abstract: According to a manufacturing method of the present invention, it is possible to manufacture a busbar assembly in an efficient manner, the busbar assembly including busbars disposed in parallel in a common plane and an insulative resin layer including a gap filling portion filled into a gap between the adjacent busbars and a bottom-surface-side laminated portion extending integrally from the gap filling portion and arranged on bottom surfaces of the busbars, a top surface of the busbar being at least partially exposed to form a top-surface-side connection portion, the bottom surface of the busbar including a first bottom surface region which is located at the same position in a thickness direction as a lower end portion of the gap and on which the bottom-surface-side laminated portion is arranged and a second bottom surface region located farther away from the top surface than the first bottom surface region and exposed to the outside to form a bottom-surface-side connection portion.Type: ApplicationFiled: September 24, 2021Publication date: November 23, 2023Inventors: Shota TATSUMI, Yuusuke ADACHI
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Publication number: 20220359101Abstract: A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.Type: ApplicationFiled: September 2, 2020Publication date: November 10, 2022Inventor: Yuusuke ADACHI
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Publication number: 20200069505Abstract: An actuator unit of the present invention includes upper and lower frames respectively connectable to a thigh frame and a lower leg frame, an actuator-side rotational connecting part connecting both frames in a rotatable manner around a pivot axis, a driver producing driving force for rotating the lower frame around the pivot axis, upper and lower connecting bodies respectively connecting the upper frame to the thigh frame and the lower frame to the lower leg frame, and an intermediate connecting body connecting the vicinity of the actuator-side rotational connecting part to the vicinity of a brace-side rotational connecting part, the intermediate connecting body having a ball stud and an accommodation depression respectively provided on one and the other of the knee-ankle-foot orthosis and the actuator unit.Type: ApplicationFiled: April 28, 2017Publication date: March 5, 2020Inventors: Yasushi FUJITA, Yuusuke ADACHI, Tadao TSUBOYAMA, Noriaki ICHIHASHI, Koji OHATA
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Patent number: 10396607Abstract: In the present invention, single-phase bus rings have single-phase-side rounded regions that are disposed at intervals on a circle smaller than a neutral-point bus ring and are positioned so that its circumferential edges are displaced in the circumferential direction relative to neutral-point-side connecting regions of the neutral-point bus ring and are positioned in a second axial position that is farther from a stator than a first axial position on which the neutral-point bus ring is partially positioned, and a pair of single-phase-side projections that extend radially outward from the circumferential edges of adjacent single-phase-side rounded regions beyond portions of the neutral-point-side rounded regions positioned in the first axial position, and are connected to each other at distal ends.Type: GrantFiled: February 20, 2015Date of Patent: August 27, 2019Assignee: Suncall CorporationInventor: Yuusuke Adachi
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Publication number: 20160365761Abstract: In the present invention, single-phase bus rings have single-phase-side rounded regions that are disposed at intervals on a circle smaller than a neutral-point bus ring and are positioned so that its circumferential edges are displaced in the circumferential direction relative to neutral-point-side connecting regions of the neutral-point bus ring and are positioned in a second axial position that is farther from a stator than a first axial position on which the neutral-point bus ring is partially positioned, and a pair of single-phase-side projections that extend radially outward from the circumferential edges of adjacent single-phase-side rounded regions beyond portions of the neutral-point-side rounded regions positioned in the first axial position, and are connected to each other at distal ends.Type: ApplicationFiled: February 20, 2015Publication date: December 15, 2016Inventor: Yuusuke ADACHI
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Publication number: 20110219219Abstract: This invention provides with a semiconductor integrated circuit, comprising a register map that makes correspondence between a register to which a CPU accesses and an address which specifies the register, wherein the register map includes a plurality of register maps in which assignments of address bits are rearranged in correspondence with each of a plurality of modes, and wherein any of the register maps is selected from the plurality of register maps according to the respective modes.Type: ApplicationFiled: May 18, 2011Publication date: September 8, 2011Applicant: PANASONIC CORPORATIONInventors: Yuusuke ADACHI, Eiji Nagata