Patents by Inventor Yuusuke Enami

Yuusuke Enami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COPPER ALLOY, COPPER ALLOY INGOT, SOLID SOLUTION MATERIAL OF COPPER ALLOY, AND COPPER ALLOY TROLLEY WIRE, METHOD OF MANUFACTURING COPPER ALLOY TROLLEY WIRE
    Publication number: 20190144974
    Abstract: A copper alloy has a composition including 0.05 mass % or more and 0.70 mass % or less of Co; 0.02 mass % or more and 0.20 mass % or less of P; 0.005 mass % or more and 0.70 mass % or less of Sn, one or more of B, Cr, and Zr; and furthermore, a Cu balance containing inevitable impurities, wherein X, Y, and Z satisfy the following Expression (1): 1?(X/5)+(Y/50)+(Z/100) and Expression (2): X+Y+Z?1,000, in case where an amount of B is represented by X (massppm), an amount of Cr is represented by Y (massppm), and an amount of Zr is represented by Z (massppm).
    Type: Application
    Filed: June 23, 2017
    Publication date: May 16, 2019
    Inventors: Yuusuke Enami, Toshio Sakamoto, Hitoshi Nakamoto, Keiichiro Oishi, Atsushi Sugahara, Chikara Yamashita, Takuya Ohara