Abstract: A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided.

Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

Abstract: Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 ?m.

Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

Abstract: There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Abstract: There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

Abstract: Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X?Y?100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region.

Abstract: Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 ?m.

Abstract: A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member.

Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

Abstract: Provided is a method of producing a shielded printed wiring board capable of sufficiently adhering to each other a printed wiring board, an adhesive layer of an electromagnetic wave shielding film on one face of the printed wiring board, and an adhesive layer of an electromagnetic wave shielding film on the other face of the printed wiring board.

Abstract: Embodiments of a printed wiring board configured to inhibit increases in electrical resistance between a ground circuit and a reinforcement member are disclosed. The printed wiring board has a substrate film with a base film and a printed circuit, which printed circuit includes a ground circuit; an adhesive layer formed on the substrate film; and a conductive reinforcement member formed on the adhesive layer. The adhesive layer includes conductive particles. One or more layers of low-melting-point metal is or are provided between the adhesive layer and the substrate film; between the adhesive layer and the reinforcement member; and/or around the conductive particles.

Abstract: The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.

Abstract: The present invention aims to provide a printed wiring board in which an increase in electrical resistance between a ground circuit and a reinforcement member of the printed wiring board is inhibited.

Abstract: The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.

Abstract: A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

Abstract: It is possible to maintain high-reliable ground effect and reinforcement function over a long period. A printed wiring board includes a base member 112 that includes a ground wiring pattern 115 and a printed wiring board reinforcing member 135 bonded to the ground wiring pattern 115 in a conductive state. The printed wiring board reinforcing member 135 includes a metal base material layer 135a and a nickel layer 135b bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern 115 of the metal base material layer 135a by diffusion bonding.