Abstract: It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.

Abstract: An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, wherein the conductive particles include conductive particles A having a median diameter of 100% or more of a thickness of the conductive adhesive layer, and conductive particles B having a median diameter of 1 to 50% of the median diameter of the conductive particles A, a content of the conductive particles is 110 to 900 parts by mass based on 100 parts by mass of the binder component, and a mass ratio of the conductive particles A to the conductive particles B is 0.1 to 7.2.

Abstract: Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X?Y?100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region.

Abstract: The present invention provides an electrically conductive adhesive layer having sufficiently high heat dissipation properties in the thickness direction while maintaining its electromagnetic wave shielding properties. The electrically conductive adhesive layer of the present invention includes a binder component and electrically conductive particles, wherein the electrically conductive particles include first particles and second particles having a smaller median diameter than the first particles, the second particles are flaky particles each including a core particle covered with a metal layer, and a percentage of a mass of the electrically conductive particles relative to a mass of the electrically conductive adhesive layer is 60 to 90 mass %.

Abstract: Provided is a thermally-conductive electrical conducting layer having excellent thermal conductivity in the thickness direction. A thermally-conductive electrical conducting layer (1) is a thermally-conductive electrical conducting layer containing a binder component (11) and electrical conducting particles (12). The electrical conducting particles (12) include electrical conducting particles A (12a) having a median diameter larger than a thickness (T) of the thermally-conductive electrical conducting layer (1) and having a thermal conductivity of 20 W/mK or more, and electrical conducting particles B (12b) having a median diameter smaller than the thickness (T) of the thermally-conductive electrical conducting layer (1). The resistivity of the thermally-conductive electrical conducting layer (1) is 2.0×10?5?·m or more.

Abstract: A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.

Abstract: A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.

Abstract: A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided.

Abstract: A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member.

Abstract: An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, wherein the conductive particles include conductive particles A having a median diameter of 100% or more of a thickness of the conductive adhesive layer, and conductive particles B having a median diameter of 1 to 50% of the median diameter of the conductive particles A, a content of the conductive particles is 110 to 900 parts by mass based on 100 parts by mass of the binder component, and a mass ratio of the conductive particles A to the conductive particles B is 0.1 to 7.2.

Abstract: Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X?Y?100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region.

Abstract: It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.

Abstract: A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided.

Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

Abstract: Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 ?m.

Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

Abstract: There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Abstract: There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

Abstract: Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X?Y?100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region.