Patents by Inventor Yuusuke Ito
Yuusuke Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10343626Abstract: An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.Type: GrantFiled: March 22, 2016Date of Patent: July 9, 2019Assignee: DAIWA KASEI INDUSTRY CO., LTD.Inventors: Kouji Kamiya, Yuusuke Ito, Makoto Suzuki, Hiroaki Suzuki, Kentaro Furuki, Masanari Ichihara
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Patent number: 9908486Abstract: An objective is to provide a manufacturing method and a manufacturing device for a wire harness, and the wire harness and a retention component manufactured thereby, the wire harness including a wiring bundle, a retention portion configured to retain the wiring bundle, and an engagement portion to be attached to a vehicle body, the manufacturing method and the manufacturing device being capable of efficiently manufacturing the wire harness and being applicable to engagement portions having different shapes.Type: GrantFiled: September 6, 2016Date of Patent: March 6, 2018Assignees: DAIWA KASEI INDUSTRY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Makoto Suzuki, Yuusuke Ito, Yousuke Ogino, Kentaro Furuki
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Publication number: 20170246997Abstract: An objective is to provide a manufacturing method and a manufacturing device for a wire harness, and the wire harness and a retention component manufactured thereby, the wire harness including a wiring bundle, a retention portion configured to retain the wiring bundle, and an engagement portion to be attached to a vehicle body, the manufacturing method and the manufacturing device being capable of efficiently manufacturing the wire harness and being applicable to engagement portions having different shapes.Type: ApplicationFiled: September 6, 2016Publication date: August 31, 2017Inventors: Makoto Suzuki, Yuusuke ITO, Yousuke Ogino, Kentaro FURUKI
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Publication number: 20160279670Abstract: An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.Type: ApplicationFiled: March 22, 2016Publication date: September 29, 2016Inventors: Kouji KAMIYA, Yuusuke ITO, Makoto SUZUKI, Hiroaki SUZUKI, Kentaro FURUKI, Masanari ICHIHARA
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Patent number: 5175052Abstract: An adhesive tape preparation of clonidine is disclosed, comprising a polytetrafluoroethylene porous sheet having an air permeability of from 10 to 500 seconds having thereon an active ingredient-containing layer comprising a pressure-sensitive adhesive obtained by copolymerizing a monomer mixture comprising from 40 to 80% by weight of 2-ethylhexyl acrylate, from 20 to 60% by weight of 2-methoxyethyl acrylate, and 0 to 40% by weight of vinyl acetate, the pressure-sensitive adhesive containing clonidine as an active ingredient. The preparation achieves sustained release of clonidine and exhibits long-term preservability while minimizing skin irritation and maintaining sufficient adhesion to the skin.Type: GrantFiled: November 13, 1991Date of Patent: December 29, 1992Assignee: Nitto Denko CorporationInventors: Shoichi Tokuda, Saburo Otsuka, Yuusuke Ito
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Patent number: 5154929Abstract: A percutaneous absorption type preparation and a process for preparing the same are disclosed. The preparation comprises a substantially drug-impermeable backing having provided thereon an adhesive layer comprising a pressure-sensitive adhesive containing therein a percutaneous absorption type drug (solid at room temperature) in an amount greater than the saturated solubility in the adhesive, wherein the excess amount of the drug greater than the saturated solubility is present in the adhesive in a continuous recrystallized state and a substantially network state.Type: GrantFiled: August 2, 1991Date of Patent: October 13, 1992Assignee: Nitto Denko CorporationInventors: Keisuke Shibata, Yuusuke Ito, Saburo Otsuka, Shoichi Tokuda, Takashi Kinoshita
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Patent number: 5151271Abstract: A pressure-sensitively adhering multilayer medicinal preparation comprises a pressure-sensitively adhering macromolecular substance layer and a polymer layer adjacent thereto and the drug and adjuvant incorporated in said preparation each can migrate from the layer of its original incorporation into the other, said adjuvant being capable of increasing absorption of the drug. In such preparation, the drug amount per unit volume can be increased.Type: GrantFiled: October 24, 1989Date of Patent: September 29, 1992Assignee: Nitti Electric Industrial Co., Ltd.Inventors: Saburo Otsuka, Yuusuke Ito, Toshiyuki Yoshikawa, Shoichi Tokuda
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Patent number: 4765974Abstract: A clonidine preparation for percutaneous administration comprising a support having provided thereon an active ingredient-containing layer is disclosed. The active ingredient-containing layer contains an acrylic polymer having a glass transition temperature of from -70.degree. C. to -10.degree. C. and pressure-sensitive adhesion at room temperature as a base, at least one of clonidine and clonidine hydrochloride as an active ingredient, and a decomposition inhibitor. The active ingredient can be stably maintained within the preparation without being decomposed, and, therefore, can be effectively released over a prolonged period of time.Type: GrantFiled: May 13, 1987Date of Patent: August 23, 1988Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Shoichi Tokuda, Yuusuke Ito, Saburo Otsuka, Takashi Kinoshita
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Patent number: 4719226Abstract: A percutaneous absorption type preparation and a process for preparing the same, where the preparation comprises a backing readily conformable to the skin or mucosa and substantially impermeable to a drug absorbed through the skin or mucosa, and an adhesive layer provided on a backing, where the adhesive layer comprises a polymer which is pressure-adhesive at room temperature and the drug present in the polymer, wherein the amount of the drug present in the adhesive layer is greater than its saturated solubility in the polymer is dispersed in the polymer in the form of recrystallized fine particles. The excess portion is again dissolved in the polymer when the drug is consumed as the result of absorption through the skin or mucosa. The drug is released continuously over a long period of time.Type: GrantFiled: December 31, 1984Date of Patent: January 12, 1988Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Saburo Otsuka, Yuusuke Ito, Shoichi Tokuda, Takashi Kinoshita, Keisuke Shibata
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Patent number: 4608249Abstract: A hydrophilic therapeutic material comprising a carrier and a drug-containing patching layer formed thereon directly or indirectly, wherein said patching layer comprises a copolymer of 5 to 75% by weight of an acrylic or methacrylic ester having an ether group in the molecule, 85 to 15% by weight of an alkyl acrylate or alkyl methacrylate and 10 to 50% by weight of a polar monomer copolymerizable therewith.Type: GrantFiled: November 2, 1982Date of Patent: August 26, 1986Assignees: Nitto Electric Industrial Co., Ltd., Toa Eiyo Litd.Inventors: Saburo Otsuka, Toshiyuki Yoshikawa, Shoichi Tokuda, Yuusuke Ito
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Patent number: 4485087Abstract: A process for obtaining a composite pharmaceutical preparation which comprises coating or laminating a composition comprising(a) an adhesive substance having a pressure-sensitive adhesive property at room temperature, and(b) a percutaneous absorption type medicine which is solid at 0.degree. C.onto a polymer film capable of allowing the medicine in contact therewith to migrate through the polymer film, the composition being prepared by adding the medicine to the adhesive substance in a higher concentration than the solubility thereof in the adhesive substance.Type: GrantFiled: March 12, 1982Date of Patent: November 27, 1984Assignee: Nitto Electric Industrial Co., Ltd.Inventors: Saburo Otsuka, Yuusuke Ito, Toshiyuki Yoshikawa, Shoichi Tokuda