Abstract: A hydraulic circuit includes: a direction switching valve, which is in a state where a bottom oil path is connected to a first tank oil path and where a bypass oil path is connected to a second tank oil path when a pump oil path is connected to a rod oil path and when the rod oil path is connected to the bypass oil path when the pump oil path is connected to the bottom oil path, and a pilot operation control valve which allows flows of oil in both directions between the direction switching valve and the bottom oil path when the pump oil path is connected to the rod oil path and allows only a flow of oil from the direction switching valve to the bottom oil path when the pump oil path is connected to the bottom oil path by the direction switching valve.

Abstract: A hydraulic circuit includes: a direction switching valve, which is in a state where a bottom oil path is connected to a first tank oil path and where a bypass oil path is connected to a second tank oil path when a pump oil path is connected to a rod oil path and when the rod oil path is connected to the bypass oil path when the pump oil path is connected to the bottom oil path, and a pilot operation control valve which allows flows of oil in both directions between the direction switching valve and the bottom oil path when the pump oil path is connected to the rod oil path and allows only a flow of oil from the direction switching valve to the bottom oil path when the pump oil path is connected to the bottom oil path by the direction switching valve.

Abstract: A hydraulic valve includes: two spools arranged in a valve main body individually movable in an axial direction and in parallel with each other, end parts thereof being housed in a common pressure chamber, and having respective guide shaft parts on the end parts thereof; a return spring provided between each of the spools and the valve main body, so that a flow of oil is controlled by a movement of the two spools with respect to the valve main body against a spring force of each of the return springs in a case where a pilot pressure is supplied to the pressure chamber; and a coupling member that is arranged in bridged between the guide shaft parts of the two spools and that is pressed in a direction of becoming closer to the spools by the return springs.

Abstract: A valve device switching between an open position and a close position, the open position allowing passage of oil through a gap between two ports in a spool bore from a small-diameter portion of a spool via a notch formed in a large-diameter portion of the spool, the close position blocking passage of oil through the gap between the two ports by the large-diameter portion, wherein the notch of the large-diameter portion has an inner bottom face at a portion located on a center side of the spool and is open to an outer peripheral space of the small-diameter portion and an outer peripheral surface of the large-diameter portion, and is formed such that an opening width of an opening at the outer peripheral surface is larger than a width of the inner bottom face.

Abstract: A valve device switching between an open position and a close position, the open position allowing passage of oil through a gap between two ports in a spool bore from a small-diameter portion of a spool via a notch formed in a large-diameter portion of the spool, the close position blocking passage of oil through the gap between the two ports by the large-diameter portion, wherein the notch of the large-diameter portion has an inner bottom face at a portion located on a center side of the spool and is open to an outer peripheral space of the small-diameter portion and an outer peripheral surface of the large-diameter portion, and is formed such that an opening width of an opening at the outer peripheral surface is larger than a width of the inner bottom face.

Abstract: An apparatus for manufacturing a semiconductor device comprises a planarization mechanism section which pressurizes a top of a bump that is provided onto at least one of a substrate and a semiconductor chip and makes the top of the bump flat, and a bonding mechanism section which bonds the substrate with the semiconductor chip via the bump whose top has been made flat by the planarization mechanism section. The planarization mechanism section has a bump recognition camera which takes an image of bumps, a planarization tool with a pressurizing surface which pressurizes the top of the bump, and a driving mechanism which controls to move the planarization tool to a position of the bump detected by the bump recognition camera, the driving mechanism comprising a pressurization mechanism which presses the pressurizing surface of the planarization tool against the bump.