Abstract: A high filler-loaded thermally conductive thin sheet is obtained by uniformly dispersing a mixture containing organic polymer particles and highly thermally conductive filler particles using a pulverizer or a mixer to obtain a powder composition, conveying the powder composition at a constant thickness between two belts of a double belt press device, and continuously heating and pressurizing the powder composition at a temperature higher than or equal to a deflection temperature under load, melting point, or a glass transition temperature of the organic polymer and at a specific pressure and then cooling and solidifying the powder composition in the double belt press device.

Abstract: A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.

Abstract: A method for manufacturing a fuel cell separator includes heating a sheet, pressing the sheet using a first die, thereby forming the sheet so as to have a predetermined thickness, cooling, together with the first die, the sheet that has been formed so as to have the predetermined thickness, and pressing the sheet that has undergone the cooling using a second die, thereby forming a gas passage in the sheet. In the sheet, a content of a thermoplastic resin is greater than or equal to 20 weight percent and less than or equal to 30 weight percent and a content of the carbon material particles is greater than or equal to 70 weight percent and less than or equal to 80 weight percent. The heating the sheet includes heating the sheet to a temperature that is higher than a melting point of the thermoplastic resin.

Abstract: [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.

Abstract: A filler-loaded thermal conductive liquid compositions formed by dispersing a powder composition, which contains polymer particles containing thermoplastic polymer particles, and thermal conductive filler particles containing particles having a graphite-like structure, obtained by pulverizing 5-70 parts by weight of the polymer particles and 30-95 parts by weight of the thermal conductive filler particles, the filler particles being covered with micronized polymer particles and the covered particles being uniformly dispersed, using 25-250 parts by weight of a liquid reactive dispersing medium and/or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than the thermoplastic polymer used in the powder composition, and the liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1-35 w/mk is formed and a concentration of thermal conductive filler particles is equal to or more than a

Abstract: [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.

Abstract: [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.